Semiconductor Exhaust Cooling Tower With Vortex Plates
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Solution Overview
Problem
Existing semiconductor manufacturing processes face inefficiencies in collecting by-products from exhaust gases due to high-temperature gases not condensing uniformly on internal collecting towers, leading to reduced condensation efficiency and increased time for gas to be converted into a solid by-product, which can cause vacuum pump failures and contamination.
Innovation Solution
An apparatus with a main cooling channel passing through an internal collecting tower, featuring vertically arranged plates with gas holes of different sizes and vortex plates, generates a vortex in the exhaust gas, enhancing surface contact and condensation efficiency by using a multi-connection pipe for coolant circulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If exhaust gas is introduced into the housing and heated to form by-products, then by-product formation is enabled, but the temperature distribution becomes non-uniform causing reduced condensation efficiency
Solution Approach 1:
The internal collecting tower is designed with non-uniform plate spacing where the gap between plates is smaller at the inlet side and larger at the outlet side. This creates local quality variations in temperature distribution, allowing the exhaust gas to maintain appropriate temperature for by-product formation while improving condensation efficiency through optimized contact with cooling surfaces at different locations.
2Stability of the object's composition
If a propeller is used to spread exhaust gas uniformly, then gas distribution is improved, but the condensation time increases due to reduced surface contact
Solution Approach 1:
Instead of using a propeller to spread gas in the horizontal plane, the invention utilizes the vertical dimension by arranging multiple plates at different heights with varying gaps. The exhaust gas flows vertically through the plate gaps, creating extended contact paths with cooling surfaces. This dimensional change allows uniform gas distribution without increasing condensation time, as the vertical flow path provides sufficient residence time for condensation.
3Ease of manufacture
If the internal collecting tower uses uniform plate spacing, then manufacturing is simplified, but the temperature distribution becomes non-uniform reducing condensation efficiency
Solution Approach 1:
The internal collecting tower is segmented into multiple plate sections with different gap sizes. The plates are divided into inlet-side plates with smaller gaps and outlet-side plates with larger gaps. This segmentation allows each section to be optimized for its specific function while maintaining overall manufacturing simplicity through modular plate assembly.
4Productivity
If exhaust gas flows quickly through the housing, then processing time is reduced, but the contact time with cooling surfaces is insufficient reducing condensation efficiency
Solution Approach 1:
The exhaust gas flow path is designed to follow a curved trajectory as it passes through the plate gaps in the internal collecting tower. The curved flow path increases the effective contact length between the exhaust gas and cooling surfaces without significantly increasing the horizontal space required. This curvature allows rapid gas processing while maintaining sufficient condensation time through extended surface contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively collects by-products at high density by optimizing temperature control and gas flow, reducing condensation time and preventing contamination, thus improving the efficiency of by-product collection and extending vacuum pump lifespan.
Implementation Method 1
a cooling channel for cooling the exhaust gas introduced into the housing
Implementation Method 2
condensing exhaust gas introduced into the housing to collect a by-product
Implementation Method 3
a heater controlling an appropriate temperature distribution in which the exhaust gas introduced into the housing can form the by-product
Implementation Method 4
vortex plates fitted to the vertical plates to generate a vortex
Data Source
AI summary
Disclosed is an apparatus having a cooling line for collecting a by-product in a semiconductor manufacturing process. The apparatus includes: a housing (110) including an inner wall plate (111) on an inner wall thereof to collect a by-product while generating a vortex in exhaust gas which is temperature-controlled by a heater (140) while being introduced through a gas inlet of an upper plate; an internal collecting tower (150) including vertical plates, an upper cover plate, and vortex plates fitted to the vertical plates, and condensing the introduced exhaust gas to collect the by-product; a main cooling channel (160) cooling the exhaust gas by using coolant while passing through the internal collecting tower (150); and a multi-connection pipe (170) sequentially supplying the coolant to an upper plate cooling channel and a main cooling channel and discharging the coolant, by using a supply pipe and a discharge pipe provided outside the housing.