Exhaust Module Heating and Solvent Dissolving to Prevent Clogging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The exhaust pipe in wafer baking apparatuses often clogs due to condensation of photoresist solvent, leading to prolonged downtime for maintenance and cleaning.
Innovation Solution
An exhaust module comprising a heating unit, a solvent dispensing unit, and a filtering unit is integrated to heat and dissolve the exhaust gas, preventing condensation and clogging. The heating unit maintains the exhaust gas above condensation temperature, while the solvent dispensing unit cools and dissolves the gas, and the filtering unit removes the solvent-exhaust gas mixture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the exhaust pipe is used to exhaust photoresist solvent from the baking chamber, then the exhaust function is achieved, but condensation occurs causing clogging and increased maintenance time
Solution Approach 1:
The patent applies parameter changes by heating the exhaust pipe to maintain a temperature above the dew point, preventing condensation of photoresist solvent. The heating unit changes the thermal parameter of the exhaust pipe from ambient temperature to elevated temperature, eliminating the harmful condensation effect while preserving the exhaust function.
Solution Approach 2:
The patent converts the harmful condensation effect into a beneficial heating function. By allowing the hot exhaust gas to heat the exhaust pipe walls, the system prevents condensation without requiring additional energy input. The harmful cold pipe surface becomes a heat exchange surface that prevents moisture accumulation.
2Reliability
If the exhaust pipe is maintained and cleaned regularly, then clogging is removed, but downtime of the wafer baking apparatus increases
Solution Approach 1:
The patent applies preliminary anti-action by proactively preventing condensation through heating before clogging can occur. The heating unit continuously maintains the exhaust pipe temperature above the dew point, preventing photoresist solvent condensation in the first place, thereby eliminating the need for frequent cleaning and maintenance downtime.
3Reliability
If the exhaust gas is heated to prevent condensation, then clogging is prevented, but energy consumption increases
Solution Approach 1:
The patent converts the thermal energy that would otherwise be wasted into a useful heating function. The hot exhaust gas, which needs to be vented anyway, is used to heat the exhaust pipe walls, preventing condensation. This recovers waste heat and eliminates the need for separate heating energy input.
Solution Approach 2:
The patent uses the kinetic energy and thermal energy of the flowing exhaust gas to heat the pipe walls through convection. The pneumatic flow of exhaust gas serves dual purposes: venting the photoresist solvent and providing the thermal energy needed to prevent condensation, eliminating the need for external heating systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents clogging of the exhaust pipe, reducing downtime and ensuring continuous operation of the wafer baking apparatus by maintaining the exhaust gas in a non-condensing state and filtering out the solvent.
Implementation Method 1
The heating unit is connected to the pipeline and configured to heat the exhaust gas
Implementation Method 2
The solvent dispensing unit is connected to the heating unit and configured to dispense a solvent to cool and dissolve the exhaust gas
Implementation Method 3
dispense a solvent to cool and dissolve the exhaust gas
Implementation Method 4
The filtering unit is connected to the solvent dispensing unit and configured to filter the solvent dissolved with the exhaust gas
Data Source
AI summary
The present disclosure provides an exhaust module for exhausting an exhaust from at least one wafer baking apparatus having an exhaust port. The exhaust module includes at least one pipeline, a heating unit, a solvent dispensing unit, and a filtering unit. The at least one pipeline is connected to the exhaust port of the wafer baking apparatus and configured to exhaust the exhaust gas from the wafer baking apparatus. The heating unit is connected to the pipeline and configured to heat the exhaust gas. The solvent dispensing unit is connected to the heating unit and configured to dispense a solvent to cool and dissolve the exhaust gas. The filtering unit is connected to the solvent dispensing unit and configured to filter the solvent.


