Exothermic Thermal Emulator for Composite Curing
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Solution Overview
Problem
Conventional autoclave control systems for composite structure production face challenges in accurately monitoring and controlling temperature gradients during the curing process, leading to potential defects and increased labor and costs due to the need for precise sensor placement and trial-and-error methods to emulate the thermal profile of composite parts.
Innovation Solution
A non-contact temperature emulator using a stacked assembly of thermally conductive plates with shim plates and an exothermic charge assembly to replicate the thermal inertia gradient of composite parts, allowing for accurate temperature control without direct contact with the part.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temperature sensors are placed inside or around the part to monitor temperature throughout the curing process, then temperature monitoring accuracy is improved, but the process becomes time and labor-intensive with increased risk of part defects
Solution Approach 1:
The patent uses a thermal emulator that copies the thermal profile of the composite part without physically contacting it. The emulator replicates the temperature distribution pattern through a stacked assembly of plates with controlled thermal properties, allowing indirect monitoring of the part's thermal state without sensor installation on or in the part itself.
Solution Approach 2:
The thermal emulator acts as an intermediary device between the autoclave and the composite part. It measures temperature at locations that indirectly represent the part's temperature distribution, eliminating the need for direct sensor placement on the part while maintaining monitoring accuracy.
2Measurement precision
If temperature sensors are placed in the trim region of the part to track temperature, then temperature tracking accuracy is improved, but the cost and complexity increase due to requiring installation of a sensor for each part
Solution Approach 1:
Instead of placing sensors in specific locations on each part, the patent creates a thermal emulator that copies the overall thermal profile of the part. The emulator's temperature distribution pattern represents the part's thermal state, eliminating the need for individual sensor installation on each part's trim region.
Solution Approach 2:
The thermal emulator serves multiple parts simultaneously by providing a universal temperature measurement system that applies to all parts of a given type. The same emulator configuration can monitor temperature for multiple parts without requiring part-specific sensor installation.
3Reliability
If conventional autoclave control systems are used with hardwired equipment and technician operation, then process control is maintained, but labor costs and potential for human error increase
Solution Approach 1:
The thermal emulator provides temperature data that feeds back to the autoclave control system, enabling automated adjustment of curing parameters. This feedback mechanism replaces manual technician monitoring and control, improving labor efficiency while maintaining reliable process control through objective temperature data.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The emulator enables precise temperature control and reduces the need for labor-intensive sensor placement, improving the accuracy and efficiency of the curing process by replicating the thermal profile of composite parts, thus minimizing defects and costs.
Implementation Method 1
an exothermic charge assembly positioned between at least one adjacent pair of thermally conductive plates... including an exotherm charge configured to react exothermally in response to a thermal cure cycle
Implementation Method 2
a plurality of thermally conductive plates configured in a stacked assembly... thermally conductive plates positioned between the pair of end plates
Implementation Method 3
a plurality of shim plates positioned between adjacent pairs of the plurality of heat sink plates
Data Source
AI summary
A temperature emulator may include a stacked assembly including a pair of end plates positioned at an uppermost and lowermost location of the stacked assembly, a plurality of heat sink plates positioned between the pair of end plates, a plurality of shim plates positioned between adjacent pairs of heat sink plates, and an exothermic charge assembly positioned between at least one pair of heat sink plates, the exothermic charge assembly including an exotherm charge configured to react exothermally in response to a thermal cure cycle.