Expandable Die Transfer Frame for Simultaneous Wafer Placement
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Solution Overview
Problem
The existing die placement processes are time-consuming and inefficient, particularly when handling large volumes of semiconductor packages, due to the manual alignment and placement of individual dies onto a supporting surface.
Innovation Solution
A system and method utilizing a stretchable mounting tape with adhesive and an expandable frame that allows multiple semiconductor dies to be placed during a single operation. The frame expands to increase the distance between the dies, enabling an entire wafer of dies to be placed simultaneously onto a substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If individual die placement is performed using pick and place operations, then precise alignment can be achieved, but the placement time and production cycle duration increase significantly
Solution Approach 1:
Multiple dies are combined onto a single wafer and processed together through the entire placement workflow. The wafer containing multiple dies is transferred, aligned, and placed as one unit rather than handling individual dies separately, thereby maintaining precision while dramatically reducing placement time.
Solution Approach 2:
Multiple dies are pre-mounted onto a wafer in advance before the placement process begins. This preliminary arrangement allows the placement system to handle multiple dies simultaneously in a single operation, eliminating the need for repeated alignment and placement operations for each individual die.
2Productivity
If multiple dies are placed simultaneously on a wafer, then production throughput increases, but the complexity of the placement apparatus increases
Solution Approach 1:
The placement system is segmented into modular functional units: a wafer handling system, an alignment system, and a placement system. Each module performs a specific function, allowing the complex task of multi-die placement to be divided into manageable steps while maintaining high throughput.
Solution Approach 2:
The placement apparatus is designed with multi-functional capabilities to handle various die sizes, wafer configurations, and placement patterns. The system can adapt to different production requirements through programmable control, reducing the need for multiple specialized devices and managing complexity through versatility.
3Productivity
If the number of dies per wafer is increased to improve efficiency, then the wafer size or die spacing must increase, but the area required for processing increases
Solution Approach 1:
A flexible mounting substrate is used to hold multiple dies in a compact arrangement. The flexible nature of the substrate allows for efficient space utilization and enables the handling of high-density die arrays without requiring proportionally larger processing areas, as the flexible material can be manipulated and folded during the placement process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the time and cost associated with die placement, enhancing production rates and profit margins by allowing for the simultaneous placement of multiple dies, thereby increasing throughput.
Implementation Method 1
The first side has an adhesive thereon and the adhesive is configured to releasably adhere to two or more semiconductor die
Implementation Method 2
A frame having an open center portion and a first frame portion and second frame portion forming an outer perimeter such that the first frame portion and the second frame portion may comprise one or more gaps
Data Source
AI summary
A system for holding a first set of die during a first placement operation onto a substrate and placing a second set of additional die onto the same substrate during a second placement operation. The first set of die have a different height than the second set of die and the sets of die may comprise an entire wafer of die. A stretchable mounting film has an adhesive to which a set of die and a frame attach. The frame has an open center portion formed by two or more outer support rail sections that are expandable to an expanded position. An optional frame lock may secure the frame in the expanded position. The frame and mounting tape can be expanded along a first axis, a second axis, or both, which separates the die adhesively attached to the mounting film.