Expandable Pressurizing Unit for Semiconductor Film Lamination
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Solution Overview
Problem
Thin printed circuit boards used in semiconductor packages are vulnerable to external forces during fabrication, leading to failures due to bubbles and warpage issues during the laminating process of protective films, which affect the yield of semiconductor packages.
Innovation Solution
A laminating device with an expandable pressurizing unit having a convex surface is used to attach a film onto a substrate, minimizing tension and preventing bubbles and warpage by expanding to contact the film with the substrate surface, while a film supply unit adjusts the film length to match the expansion, ensuring proper attachment without deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a protective film is attached onto a thin printed circuit board to enhance stiffness, then the strength and stability of the board is improved, but bubbles and warpage are generated during the laminating process which cause defects
Solution Approach 1:
The pressurizing unit is designed to be expandable rather than rigid, allowing it to dynamically adjust its volume and pressure during the lamination process. This dynamic characteristic enables the pressurizing unit to adapt to the film and substrate without generating excessive tension that would cause warpage or bubbles.
Solution Approach 2:
The invention changes the physical state and parameters of the pressurizing unit by expanding it from a compressed to an expanded state during lamination. This parameter change allows the pressurizing unit to apply controlled pressure and tension to the film, ensuring proper adhesion without causing defects.
2Device complexity
If a rigid pressurizing unit is used to attach the film, then the lamination process is simple, but the film tension causes bubbles and warpage
Solution Approach 1:
The pressurizing unit transitions from a static rigid structure to a dynamic expandable structure. This allows the system to maintain simplicity in operation (expand/contract cycles) while achieving superior film attachment quality through controlled expansion that minimizes tension.
Solution Approach 2:
The pressurizing unit utilizes pneumatic expansion (injecting air into the unit) to achieve controlled expansion and contraction. This pneumatic mechanism provides a simple yet effective way to control the pressing force and tension applied to the film during lamination.
3Manufacturing precision
If the pressurizing unit expands to minimize film tension, then bubbles and warpage are prevented, but the film length must be adjusted to match the expansion
Solution Approach 1:
The film supply unit is configured to respond to and coordinate with the expansion state of the pressurizing unit. This feedback mechanism ensures that the film length supplied matches the expansion level, maintaining proper tension and preventing defects without requiring complex independent control systems.
Solution Approach 2:
The film supply unit and pressurizing unit are integrated to work in coordination, where the film supply is synchronized with the expansion/contraction cycles. This merging of functions simplifies the overall control architecture while achieving precise film attachment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves the yield of semiconductor packages by minimizing film tension and preventing defects such as bubbles and warpage, enhancing the reliability and integrity of the packaging process.
Implementation Method 1
injecting air into the pressurizing unit using a plate which is connected to the pressurizing unit
Data Source
AI summary
A method of fabricating a semiconductor package using a laminating device is provided. The method includes placing a substrate on a substrate stand; providing a pressurizing unit which is expandable and includes a convex surface facing an upper surface of the substrate stand, on the substrate stand; injecting air into the pressurizing unit using a plate which is connected to the pressurizing unit; and supplying a film by a film supply unit which supplies the film between the substrate stand and the pressurizing unit, wherein the pressurizing unit attaches the film onto the substrate, while expanding.