Expandable Sheet Expansion for Maintaining Chip Spacing

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Solution Overview

Problem

Existing methods for expanding expandable sheets to maintain spaces between chips in workpieces are costly, time-consuming, and limit transportability due to the need for thick inner and outer rings or heat shrinking, reducing manufacturing efficiency.

Innovation Solution

An expansion method and apparatus that uses a first and second ring frame to radially expand an expandable sheet by pressing it outwardly, fixing it to a second ring frame without thick rings, and cutting it to maintain enlarged chip spaces efficiently.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If heat shrinking is used to maintain enlarged spaces between chips, then the spaces between chips are maintained, but the manufacturing cost increases and manufacturing time increases

Engineering Contradiction:

Improvespace maintenance between chipsVSAvoidmanufacturing efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent extracts the heating function from the expansion apparatus by using a separate heating device to heat only the expandable sheet in the expansion region, rather than heating the entire workpiece unit. This selective heating maintains chip spaces while reducing unnecessary energy consumption and manufacturing time.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent performs preliminary expansion of the expandable sheet before chip division to create sufficient space between chips. This preliminary action eliminates the need for post-expansion heat shrinking, thereby maintaining manufacturing precision while improving productivity.

Inventive Principle:

Principle #10Preliminary action

2Manufacturing precision

If the expandable sheet is sandwiched between inner ring and outer ring, then the enlarged spaces between chips are maintained, but the thickness of the integrated object increases

Engineering Contradiction:

Improvespace maintenance between chipsVSAvoidthickness of integrated object

Core Design Contradiction:

Manufacturing precisionVSLength of stationary object

Solution Approach 1:

The patent removes the inner ring and outer ring structures entirely, replacing them with a simplified expansion mechanism that uses a single ring frame. This extraction of unnecessary components maintains the space between chips while significantly reducing the thickness of the integrated object.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent uses a thin expandable sheet made of flexible material that can be expanded radially to maintain chip spaces without requiring thick supporting rings. The flexible nature of the sheet allows it to conform to the chip arrangement while maintaining sufficient spacing.

Inventive Principle:

Principle #30Flexible shells and thin films

3Manufacturing precision

If the expandable sheet is sandwiched between inner ring and outer ring, then the enlarged spaces between chips are maintained, but the transportability of integrated objects decreases

Engineering Contradiction:

Improvespace maintenance between chipsVSAvoidtransportability

Core Design Contradiction:

Manufacturing precisionVSEase of operation

Solution Approach 1:

The patent extracts the bulky inner and outer ring structures and replaces them with a compact single-ring configuration. This reduction in overall dimensions maintains chip spacing precision while significantly improving transportability by allowing more integrated objects to be accommodated in a cassette.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent employs a nested structure where the expandable sheet is integrated within the single ring frame, allowing the components to be compactly arranged. This nesting approach maintains functional precision while minimizing the overall footprint for improved transportability.

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method and apparatus enable efficient expansion and fixation of the expandable sheet, reducing costs and time, enhancing manufacturing efficiency, and improving transportability of chips without the need for heat shrinking or thick rings.

Implementation Method 1

radially expanding, after disposing the first ring frame and the second ring frame, the expandable sheet by pressing the expandable sheet at a position inside the opening of the first ring frame

Methodology Applied

Scientific EffectRadial expansion:

Implementation Method 2

heating an area of the expandable sheet exposed between the workpiece and the ring frame to cause shrinkage of the area, thereby maintaining the enlarged spaces between the chips

Methodology Applied

Scientific EffectHeat shrinking: Thermal Contraction

Data Source

PatentUS20250385137A1Expansion method and expansion apparatus

Publication Date: 2025.12.18 DISCO CORP

AI summary

Disclosed is an expansion method for expanding an expandable sheet of a workpiece unit including a plate-shaped workpiece, a first ring frame, and the expandable sheet attached to the workpiece and the first ring frame. A central area of the expandable sheet is pressed in directions inclined radially outward with respect to a direction perpendicular to an opening of the first ring frame, distances between respective chips formed as a result of division of the workpiece are increased, and the expanded expandable sheet is fixed to a second ring frame.