Expandable Wafer Chuck for Stress-Adaptive Bond Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
During semiconductor wafer handling and bonding, stress and displacement issues arise due to the imparted stress, which can impact alignment, performance, and yield in semiconductor devices.
Innovation Solution
A semiconductor chuck with a first portion having multiple first couplers for actuators and a second portion with multiple segments, each with a wafer holder and second couplers for actuators, is used. These actuators, potentially including piezo electric elements, adjust the position of the wafer holders to manage stress and alignment during wafer bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the outer portion of the wafer is fixed by a wafer holder during bonding, then the wafer can be held in place for stable processing, but the propagation wave causes initial lateral tensile stress followed by lateral compressive stress that can impact alignment and device performance
Solution Approach 1:
The wafer holder's outer portion is made dynamically adjustable rather than fixed. Actuators enable the outer portion to move radially outward in response to detected propagation waves, allowing the system to adapt its constraint level based on real-time bonding conditions. This dynamic adjustment prevents stress accumulation while maintaining wafer stability throughout the bonding process.
Solution Approach 2:
The system incorporates sensors that detect propagation waves during wafer bonding and provide feedback to the actuator control system. This feedback loop enables real-time monitoring and adjustment of the outer portion's position, allowing the system to respond to stress conditions as they develop and maintain optimal alignment precision throughout the bonding process.
2Manufacturing precision
If actuators are used to adjust the lateral position of the wafer holder to reduce stress, then alignment and device performance improve, but the device complexity increases
Solution Approach 1:
The wafer holder is segmented into an inner portion and an outer portion that can move independently. This segmentation allows the outer portion to be adjusted by actuators while the inner portion remains stable. The segmented design enables stress management functionality without requiring complete redesign of the entire wafer holder, thus limiting the increase in overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages stress and alignment during semiconductor wafer bonding, enhancing the performance and yield of semiconductor devices by controlling the position of wafer holders in response to propagation waves detected during the bonding process.
Implementation Method 1
The actuators can include a piezo electric element
Data Source
AI summary
Expandable semiconductor chucks are disclosed. The semiconductor chucks can include a first portion comprising a plurality of first couplers configured to receive a corresponding plurality of actuators. The semiconductor chucks can include a second portion circumscribed about the first portion, the second portion comprising a plurality of segments. Each segment can include a wafer holder to selectively couple the respective segment to a semiconductor wafer. Each segment can include a second coupler to receive one or more of the plurality of actuators. The actuators can extend to increase a dimension between the first portion and the second portion and retract to decrease a dimension between the first portion and the second portion.