On-Package Expanded Beam Connectors for Detachable PIC Fiber Arrays
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Solution Overview
Problem
Existing photonic integrated circuit (PIC) packaging faces challenges in achieving stable optical connections with fiber arrays, leading to manufacturing inefficiencies and high costs due to fragile fiber pigtails, misalignment issues, and complex automation, which result in reduced yields and increased production costs.
Innovation Solution
The implementation of paired attachable/detachable expanded beam connectors, comprising on-package and off-package fiber array connectors, allows for collimated and expanded optical beam coupling, using 3D printed optical materials, enabling high-density interconnects with pitch less than 10 microns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional fiber array connectors are used for PIC packaging, then optical connections can be established, but the fiber pigtails are fragile and prone to misalignment, reducing manufacturing yield and increasing costs
Solution Approach 1:
The connector is divided into two separate parts: an on-package connector integrated with the PIC and an off-package connector that receives the fiber array. This segmentation allows the fiber array to be attached to the off-package connector separately, eliminating the need for fragile fiber pigtails to bridge the connection and reducing misalignment risks during assembly.
Solution Approach 2:
The on-package connector serves as an intermediary component that provides a stable mounting interface on the PIC package. This intermediary structure enables reliable optical coupling by providing precise alignment features and a robust mechanical interface between the PIC and the fiber array, eliminating the fragility issues of traditional direct fiber-to-PIC connections.
2Manufacturing precision
If traditional fiber array attachment methods are used, then optical connections can be made, but misalignment issues occur leading to reduced yields
Solution Approach 1:
The on-package connector is pre-integrated with the PIC during PIC fabrication, establishing precise alignment features and optical paths before the fiber array is attached. This preliminary action ensures that when the fiber array is later mounted to the off-package connector, the alignment is already predetermined and precise, eliminating misalignment issues during final assembly.
Solution Approach 2:
The connector design provides equivalent alignment precision for all fiber-to-waveguide couplings within the array. By establishing uniform alignment features and optical reference planes across all connection points, the system achieves consistent alignment precision throughout the entire fiber array, ensuring high yields across all optical channels.
3Ease of manufacture
If complex automation is used for fiber array attachment, then connections can be established, but the process becomes more complex and costly
Solution Approach 1:
The on-package connector is designed to be self-aligning and self-locating through integrated mechanical features such as guide pins, alignment grooves, and reference planes. These features enable the connector to automatically establish precise alignment during attachment without requiring complex external automation or alignment systems, simplifying the manufacturing process while maintaining high precision.
4Manufacturing precision
If high-density interconnects with pitch less than 10 microns are implemented, then optical coupling efficiency improves, but manufacturing difficulty increases
Solution Approach 1:
The connector integrates multiple functions into a single component: mechanical mounting, optical alignment, and physical protection. By merging the alignment features, mounting structure, and optical interface into the on-package connector, the design achieves high-density interconnect capability with pitch less than 10 microns while simplifying the overall manufacturing process, as the integrated connector handles all precision requirements in one element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances manufacturing efficiency by allowing for easy attachment and detachment of fiber arrays, reduces misalignment risks, and supports high-volume manufacturing while maintaining optical signal integrity, thereby lowering production costs and improving yield.
Implementation Method 1
a second optical element to expand and collimate the optical beam
Data Source
AI summary
Photonic IC packages, related devices and methods, are disclosed herein. In some embodiments, a photonic package may include a substrate; a photonic integrated circuit (PIC) having a first optical element, the PIC coupled to the substrate; a connector including a fiber alignment structure; and a second optical element, wherein the second optical element is to expand and collimate an optical beam, and wherein a material of the connector includes a 3-dimensional (3D) printing optical polymer, a 3D printing grade glass, a 3D printing optical resin, a fused silica glass, or an optical grade polymer; and a fiber having a first end and an opposing second end, wherein the fiber is positioned in the fiber alignment structure, and wherein the first end of the fiber is optically coupled to the first optical element and the second end of the fiber is optically coupled to the second optical element.