Expansion Card Cooling and Structural Integration
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Solution Overview
Problem
Expansion cards face challenges in managing heat dissipation and shock resistance due to large and heavy cooling solutions, which can compromise computing performance and structural integrity, especially in compact systems.
Innovation Solution
The integration of a metallic duct with direct thermal connections, a centrifugal fan, and a secondary plate, along with a clamp structure and power connector design, provides synergistic cooling, structural support, and volume reduction, enabling efficient heat dissipation and shock absorption while maintaining computing performance in constrained spaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If large and heavy cooling solutions (heat sinks) are added to dissipate heat from high-power expansion cards, then heat dissipation capability is improved, but weight and volume increase, compromising shock resistance and system compactness
Solution Approach 1:
The patent combines multiple functions into a single integrated cooling assembly that includes a heat sink, centrifugal fan, and shock-absorbing elements. This merging eliminates the need for separate heavy cooling components while achieving both effective heat dissipation and shock protection for the expansion card
Solution Approach 2:
The cooling assembly utilizes composite construction with heat conductive materials (such as aluminum or copper heat sink) combined with shock-absorbing materials (such as rubber or foam elements). This composite approach enables the single component to simultaneously manage thermal dissipation and mechanical shock protection without excessive weight
2Temperature
If large and heavy cooling solutions (heat sinks) are added to dissipate heat from high-power expansion cards, then heat dissipation capability is improved, but volume increases, limiting availability in compact systems
Solution Approach 1:
The patent integrates the heat sink, centrifugal fan, and shock-absorbing elements into a single compact cooling assembly that attaches directly to the expansion card. This integration eliminates the need for separate large-volume cooling components while maintaining effective heat dissipation capability in limited space
Solution Approach 2:
The cooling assembly is designed to attach to the expansion card in a manner that utilizes available three-dimensional space efficiently, with the heat sink extending perpendicular to the card surface and the fan positioned to maximize airflow without increasing excessive volume in any single dimension
3Temperature
If cooling solutions are added to high-power expansion cards, then heat dissipation is improved, but structural integrity and shock resistance are compromised due to added weight
Solution Approach 1:
The patent combines cooling functionality with shock protection by integrating shock-absorbing elements (such as rubber or foam pads) directly into the cooling assembly structure. This ensures that the same component providing heat dissipation also protects against mechanical shock, maintaining reliability without sacrificing thermal management
Solution Approach 2:
The cooling assembly includes pre-installed shock-absorbing elements positioned between the cooling components and the expansion card. These elements provide beforehand cushioning that protects the card and its components from shock and vibration during operation and transport
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates heat, enhances structural integrity, and reduces shock risk, allowing for high-power computing operations without compromising on size or weight, even in tight volume constraints.
Implementation Method 1
The metallic duct can include one or more flange surfaces having a direct thermal connection with one or more of the first set of semiconductor packages
Implementation Method 2
a centrifugal fan
Implementation Method 3
the addition of heat sinks and other cooling solutions to the cards may be needed in order dissipate heat generated by card components. Certain cooling solutions, however, may be relatively large and heavy, which can lead to concerns with regard to shock resistance
Data Source
AI summary
Systems and methods of fabricating circuit board assemblies may provide for a circuit board assembly that includes an expansion card having a first side and a second side, a first set of semiconductor packages coupled to the first side and a second set of semiconductor packages coupled to the second side. The circuit board assembly may also include a synergistic combination of cooling solutions for the expansion card such as a metallic duct, centrifugal fan or secondary plate, structural solutions for the expansion card such as a clamp structure or retention interlock, and volume reduction solutions for the expansion card such as one or more flipped power connectors.