Expansion Card Module Using Circuit Board Storage And Shared Heat Dissipation

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Solution Overview

Problem

Existing expansion cards with storage units face compatibility issues with motherboards, leading to incomplete functionality and potential heat management challenges.

Innovation Solution

An expansion card module design featuring a circuit board with dual connectors, allowing direct signal transmission between the storage unit and motherboard, and a heat sink for combined heat dissipation with the storage unit and expansion card.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the storage unit is directly connected to the expansion card, then the expansion card can provide storage functionality, but compatibility problems occur with motherboards

Engineering Contradiction:

ImprovecompatibilityVSAvoidfunctionality

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The system is divided into separate functional modules: the expansion card handles graphics processing, the circuit board provides standardized connectivity interfaces, and the storage unit is independently connected through the circuit board's first connector. This segmentation allows each component to operate independently with standardized interfaces, improving compatibility while maintaining full functionality.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The circuit board acts as an intermediary between the expansion card and the storage unit. It provides standardized connectors that are compatible with motherboards while enabling the storage unit to be properly recognized and functional. The circuit board mediates the connection, translating between different interface requirements.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If the storage unit is connected through the expansion card, then storage functionality is provided, but heat dissipation becomes problematic

Engineering Contradiction:

ImprovefunctionalityVSAvoidheat dissipation

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

Heat-generating components (expansion card and storage unit) are physically separated and positioned adjacent to the heat sink rather than being integrated together. This segmentation allows independent thermal management for each component while maintaining their functional connections through the circuit board.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heat generated by the storage unit and expansion card is converted into a manageable thermal flow directed toward the heat sink. The proximity arrangement transforms the harmful heat accumulation into a controlled thermal transfer process, where the heat naturally dissipates through the heat sink's surface area.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Adaptability or versatility

If the storage unit occupies space on the expansion card, then storage functionality is integrated, but the expansion card space is limited

Engineering Contradiction:

ImproveintegrationVSAvoidexpansion card space

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The storage unit is relocated from the two-dimensional surface of the expansion card to a separate spatial dimension adjacent to the heat sink. This dimensional relocation frees up the expansion card surface area while maintaining the storage functionality through the circuit board connection. The system transitions from a planar integration to a three-dimensional spatial arrangement.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances compatibility and improves heat dissipation, ensuring full functionality and efficient operation of storage units without occupying expansion card space.

Implementation Method 1

the heat sink is located next to the expansion card and storage unit and is thermally coupled to the expansion card and storage unit

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250294666A1Expansion card module

Publication Date: 2025.09.18 ASUS GLOBAL PTE LTD

AI summary

This disclosure discloses an expansion card module, including an expansion card, a circuit board, a storage unit, and a heat sink. The circuit board is disposed next to the expansion card and includes a first connector and a second connector. The storage unit is pluggably disposed on the first connector of the circuit board. The heat sink is located next to and thermally coupled to the expansion card and storage unit. The storage unit of the expansion card module in this disclosure transmits signals through the circuit board. Since there is no need to transmit signals through the expansion card, the storage unit and the motherboard may have better compatibility. In addition, the storage unit and the expansion card dissipate heat together through the heat sink, thus having a good heat dissipation effect.