Expansion device
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Solution Overview
Problem
Existing refrigeration circuit systems face challenges in achieving efficient and cost-effective operation, particularly in terms of energy efficiency, component quality, and assembly complexity between the condenser and evaporator, with a need for a standardized and compact expansion device that can maintain high energy efficiency and reduce production time.
Innovation Solution
A compact expansion device with a shell unit and cover unit designed to house functional units such as heat exchangers, sensors, and gas-liquid separators, featuring a thermally conductive casing and insulating elements, and incorporating a multi-way valve for reversible operation, allowing for efficient heat exchange and reduced assembly complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple functional units are integrated into the expansion device, then energy efficiency and functionality are improved, but device complexity increases
Solution Approach 1:
The patent integrates multiple functional units (heat exchanger, sensor, gas-liquid separator, multi-way valve) into a single expansion device housing, combining previously separate components into one integrated assembly. This merging approach improves energy efficiency by reducing heat losses between components while maintaining manageable complexity through modular internal design.
Solution Approach 2:
The expansion device is designed as a multi-functional unit that simultaneously performs expansion, heat exchange, sensing, gas-liquid separation, and flow direction control. This universal design consolidates multiple functions into one device, improving system energy efficiency while the modular internal structure keeps assembly complexity manageable.
2Productivity
If a compact expansion device with integrated functional units is used, then production time and assembly complexity are reduced, but manufacturing precision requirements increase
Solution Approach 1:
The expansion device is designed with a modular structure where functional units (heat exchanger, sensor, gas-liquid separator, multi-way valve) are segmented into distinct components that can be manufactured separately and then assembled. This segmentation reduces production time for each component while the standardized interfaces maintain manageable assembly precision requirements.
Solution Approach 2:
Multiple functional units are nested within the expansion device housing, with smaller components (sensor, gas-liquid separator) positioned inside or alongside larger components (heat exchanger, multi-way valve). This nesting approach creates a compact design that reduces overall production time while the hierarchical structure simplifies assembly sequencing.
3Temperature
If thermally conductive casing and insulating elements are implemented, then thermal management is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The expansion device employs differentiated thermal properties in different regions: thermally conductive materials are used in areas requiring heat transfer (heat exchanger connections, casing), while insulating elements are applied in areas requiring thermal isolation. This local quality approach optimizes thermal management without uniformly increasing structural complexity throughout the entire device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact, energy-efficient, and cost-effective refrigeration circuit system with reduced assembly complexity, improved thermal management, and efficient operation in both heat pump and refrigeration machine modes, while minimizing energy losses and production time.
Implementation Method 1
the condenser and the evaporator are each provided for an exchange of heat between the refrigerant and the environment or an external fluid circuit
Implementation Method 2
The casing unit is preferably made entirely or partially from a thermally conductive material, in particular with a thermal conductivity of more than 1 W/mK, preferably more than 10 W/mK, particularly preferably more than 100 W/mK
Implementation Method 3
The expansion device optionally has a number of insulating elements which together at least essentially completely surround the casing unit
Data Source
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AI summary
The invention relates to an expansion device for an expansion element (12a; 12b; 12c; 12d; 12f), in particular for a throttle valve or for an expansion valve, of a refrigeration circuit system, wherein the refrigeration circuit system comprises at least one evaporator (14a; 14b; 14c; 14e; 14f) and at least one condenser (16a; 16b; 16c; 16e; 16f), wherein the expansion device has at least one condenser connection (18a; 18b; 18c; 18d; 18e; 18f) and at least one evaporator connection (20a; 20b; 20c; 20d; 20e; 20f), wherein these connections (18a, 20a; 18b, 20b; 18c, 20c; 18d, 20d; 18e, 20e; 18f, 20f) are provided for fluid-technical integration into the refrigeration circuit system, and with at least one functional unit (22a, 24a, 26a, 28a, 30a, 31a; 26b, 28b, 31b; 22c, 24c, 26c, 28c, 29c, 31c; 22d, 24d, 26d, 28d, 29d; 22e, 24e, 26e, 29e ...6e, 29e; 22e, 24e, 26e, 26e, 29e; 22e, 24e, 26e, 26e, 26f) which is designed differently from the condenser (16a; 16b; 16c; 16e; 16f) and the evaporator (14a; 16b; 16c; 16e; 16e; 16f) and the evaporator (14a; 14b; 14c; 14e; 14f) in particular.22f, 26f, 28f, 31f), to an operation of the refrigeration circuit system. It is proposed that the expansion device be a shell unit (32a; 32b; 32c; 32d; 32e; 32f) with at least one outer surface (34a, 36a) on which the connections (18a, 20a; 18b, 20b; 18c, 20c; 18d, 20d; 18e, 20e; 18f, 20f) are arranged, and at least one interior space in which the functional unit (22a, 24a, 26a, 28a, 30a, 31a; 26b, 28b, 31b; 22c, 24c, 26c, 28c, 29c, 31c; 22d, 24d, 26d, 28d, 29d; 22e, 24e, 26e, 29e; 22f, 26f, 28f, 31f) is arranged, exhibits.;