Expansion Device Housing Multiple PCIe Modules in Standard Drive Bay

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Solution Overview

Problem

The evolution of data storage devices, particularly the shift from HDDs to SSDs, reveals a need for an expansion device that can accommodate multiple PCIe modules within a standard drive bay form factor, optimizing device orientation for improved performance and heat dissipation, while allowing for tool-less installation and multiple configuration options.

Innovation Solution

An expansion device utilizing a PCIe switch and connecting circuitry to house multiple PCIe modules within a 3.5" HDD form factor, providing two alternative orientations for optimal airflow and heat dissipation, and enabling tool-less assembly and removal of components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If multiple PCIe modules are housed within a standard drive bay form factor, then space utilization is improved, but device complexity increases

Engineering Contradiction:
Improvespace utilizationVSAvoiddevice complexity
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The expansion device is divided into a housing and a removable carrier assembly. The carrier can be independently removed from the housing, allowing users to access and replace PCIe modules without tools. This segmentation resolves the contradiction by organizing multiple modules in a structured, manageable way that simplifies complexity while maintaining high space utilization.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple PCIe modules are nested within a single carrier assembly, which itself is nested within the expansion device housing. This nested structure allows multiple devices to occupy a compact volume (standard drive bay form factor) while maintaining individual accessibility through the removable carrier design.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Adaptability or versatility

If PCIe modules are provided in multiple orientations, then adaptability is improved, but device complexity increases

Engineering Contradiction:
ImproveadaptabilityVSAvoiddevice complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The carrier assembly is designed to be rotatable within the housing, allowing the PCIe modules to be oriented in different directions (e.g., upward or sideways) depending on the installation environment's airflow and heat dissipation requirements. This dynamic reconfigurability provides adaptability without permanently increasing structural complexity.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The expansion device is designed to accommodate various types of PCIe modules (SSDs, GPUs, wireless cards) in multiple orientations, making it a universal solution that adapts to different performance and thermal management needs without requiring multiple specialized device designs.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Ease of operation

If tool-less installation is enabled, then ease of operation is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improveease of installationVSAvoidmanufacturing precision
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The carrier assembly incorporates self-latching mechanisms and snap-fit connectors that automatically secure PCIe modules when inserted, eliminating the need for tools or complex assembly procedures. The design provides intuitive, tool-less installation while the standardized dimensions ensure proper alignment and connection.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The connector interfaces are designed with specific dimensional parameters and tolerances that enable automatic alignment and secure engagement without tools. By carefully controlling these manufacturing parameters, the device achieves both ease of operation and reliable connections.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS10929327B1Expansion device housing multiple components
Publication Date: 2021.02.23 AMD DESIGN LLC
  • US10929327B1 patent drawing
  • US10929327B1 patent drawing
  • US10929327B1 patent drawing

AI summary

An expansion device is disclosed for including a plurality of modular devices within a pre-defined volume, such as the drive bay of a computing device. The expansion device may include a standardized bus connection and circuitry connecting to a controller chip, circuitry electrically coupling the controller chip to a plurality of modular devices, and a housing that houses the controller chip, connecting circuitry, and modular devices and that fits within the pre-defined volume.