Explosive Device Surface Energy Control via PVD
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Solution Overview
Problem
Conventional methods for producing explosive devices result in performance variability due to inherent differences in density and porosity, leading to unpredictable detonation characteristics, and existing solutions like microscale engineering are costly.
Innovation Solution
Modifying the surface energy of a substrate through techniques like etching or depositing high surface energy materials in a vacuum environment before depositing explosive materials via physical vapor deposition to control density and porosity, allowing for precise control over detonation velocity and wave shape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional wet chemical synthesis and pressing techniques are used to form explosive powder, then the explosive device can be manufactured, but the density and porosity vary leading to inconsistent detonation velocity
Solution Approach 1:
The patent changes the physical state and deposition parameters of the explosive material by using physical vapor deposition instead of wet chemical synthesis. By controlling deposition parameters such as deposition rate, substrate temperature, and vacuum conditions, the explosive material forms with uniform density and porosity, eliminating the performance variability inherent in conventional pressing techniques.
Solution Approach 2:
The patent replaces the mechanical pressing system with a physical vapor deposition system. Instead of mechanically compacting explosive powder into desired shapes, the explosive material is deposited in a vacuum environment, allowing atomic-level control over material placement and eliminating the density variations caused by mechanical compression.
2Manufacturing precision
If microscale engineering and MEMS fabrication techniques are used to control explosive material properties, then detonation characteristics can be precisely controlled, but the manufacturing cost increases significantly
Solution Approach 1:
The patent extracts the essential function of microscale engineering (controlling material properties) and implements it through a simpler, more cost-effective physical vapor deposition process. By depositing explosive material directly in a vacuum, the need for expensive post-deposition microscale processing is eliminated while maintaining precise control over material properties.
Solution Approach 2:
The patent uses a straightforward physical vapor deposition process that does not require expensive, complex MEMS fabrication equipment or multiple processing steps. The method achieves the desired material properties through a single, relatively simple deposition process, significantly reducing manufacturing costs compared to microscale engineering approaches.
3Manufacturing precision
If physical vapor deposition is used to deposit explosive material in a vacuum environment, then density and porosity can be controlled, but the process complexity increases
Solution Approach 1:
The patent combines the material deposition and property control functions into a single physical vapor deposition process. By controlling deposition parameters such as deposition rate, substrate temperature, and vacuum pressure, the desired density and porosity are achieved during the deposition itself, eliminating the need for separate post-processing steps to control these properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the manufacture of explosive devices with consistent and desired detonation properties, enhancing sensitivity and output while reducing costs by eliminating the need for post-fabrication processing.
Implementation Method 1
a substrate (e.g., formed of silicon, plastic, metal, etc.) can be subjected to etching techniques (e.g., argon ion sputtering), wherein surface of the substrate that has been subject to etching has a higher surface energy than the surface of the substrate prior to etching
Implementation Method 2
Once the surface energy of the substrate is increased, explosive material can be deposited onto the surface of the substrate by way of physical vapor deposition (PVD)
Data Source
AI summary
An explosive device is described herein, wherein the explosive device includes a substrate that has a surface, wherein surface energy of a portion of the surface of the substrate has been modified in a vacuum chamber from a first surface energy to a second surface energy. The explosive device additionally includes explosive material that has been deposited on the surface of the substrate in the vacuum chamber by way of physical vapor deposition (PVD), wherein the explosive material is deposited on the portion of the surface of the substrate subsequent to the surface energy of the portion of the surface of the substrate being modified from the first surface energy to the second surface energy.