Exposed Antenna in Semiconductor Package for RF Signal Loss Reduction
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Solution Overview
Problem
High-frequency RF signal attenuation in dielectric layers of semiconductor device packages poses a challenge for wireless communication devices, leading to signal loss and reduced performance.
Innovation Solution
A semiconductor device package design featuring a substrate with a support structure and an antenna having a dielectric layer and an antenna pattern, where the antenna is exposed to the external environment, eliminating the need for signal transmission through dielectric material, thereby reducing signal attenuation by using air as the medium for RF signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the antenna is disposed within or on a dielectric layer for wireless communication, then the antenna structure is integrated into the device, but signal attenuation increases at high frequencies
Solution Approach 1:
The patent extracts the antenna from the dielectric layer environment and places it in an air-filled cavity. The cavity structure removes the antenna from contact with lossy dielectric materials, allowing RF signals to propagate through air instead, thereby reducing signal attenuation and improving transmission quality at high frequencies.
Solution Approach 2:
The air-filled cavity acts as an intermediary medium between the antenna and the external environment. This air medium has lower dielectric loss compared to solid dielectric materials, serving as an effective mediator for RF signal transmission and reducing energy loss during signal propagation.
2Productivity
If the antenna is exposed to the external environment, then signal transmission efficiency improves, but the antenna structure becomes more complex
Solution Approach 1:
The patent merges the antenna structure with the cavity structure, where the cavity serves dual purposes: it provides the air-filled environment for reduced signal attenuation and simultaneously acts as the protective enclosure. This integration reduces overall structural complexity while maintaining the benefits of exposed antenna operation.
Solution Approach 2:
The cavity structure performs multiple functions: it provides the air-filled transmission medium, protects the antenna from environmental damage, and defines the antenna's operational space. This multi-functionality reduces the need for additional separate components, thereby managing structural complexity while improving signal transmission efficiency.
Data Source
AI summary
A semiconductor device package includes a substrate, a support structure and a first antenna. The substrate has a first surface and a second surface opposite to the first surface. The support structure is disposed on the first surface of the substrate. The first antenna is disposed on the support structure. The first antenna has a first surface facing the substrate, a second surface opposite to the first surface and a lateral surface extending between the first surface and a second surface of the first antenna. The lateral surface of the first antenna is exposed to the external of the semiconductor device package. The first antenna includes a dielectric layer and an antenna pattern disposed within the dielectric layer and penetrating the dielectric layer.