Top Exposed Semiconductor Chip Package with V-Groove Lead Frame
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving high thermal dissipation, low parasitic inductance, and low electrical resistance while maintaining cost-effectiveness and precision alignment, which are essential for improving device performance and reducing assembly costs.
Innovation Solution
The proposed semiconductor package design features a lead frame with exposed metal plates and grooves for enhanced electrical contact, combined with a plastic package body that encapsulates the chip and leads, allowing for efficient heat dissipation and reduced parasitic inductance and resistance, and an assembly method that includes bonding wires and conductive adhesives to ensure precise alignment and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If clip bonding is used to interconnect active components, then parasitic resistance and inductance are reduced, but assembly cost increases due to high precision alignment requirements
Solution Approach 1:
The invention divides the interconnection structure into modular segments: the lead frame is separated into distinct functional zones (mounting area, connection area, heat dissipation area), and the chip is divided into separate bonding regions. This segmentation allows for standardized, pre-fabricated components that reduce assembly complexity and cost while maintaining low parasitic characteristics through optimized segment design.
Solution Approach 2:
The lead frame is pre-formed with precise geometric configurations, pre-bonded connection points, and integrated heat dissipation structures before chip assembly. The mounting structure is prepared in advance with predetermined alignment features, eliminating the need for high-precision alignment during the actual bonding process, thereby reducing assembly cost while maintaining electrical performance.
2Temperature
If traditional packaging structures are used, then manufacturing is simpler, but thermal dissipation performance is insufficient
Solution Approach 1:
The lead frame is designed as a multi-functional component that simultaneously serves as: (1) electrical interconnection carrier, (2) mechanical mounting structure, and (3) heat dissipation pathway. The exposed metal plates and grooves perform multiple functions including electrical contact, thermal conduction, and structural support, eliminating the need for separate heat sink and mounting components, thus improving thermal dissipation without proportionally increasing complexity.
Solution Approach 2:
The lead frame acts as an intermediary component that bridges the chip, the circuit board, and the heat dissipation system. The exposed metal plates and grooves on the lead frame create optimized thermal and electrical pathways between these elements, enabling efficient heat transfer from the chip through the lead frame to the circuit board and external heat sinks, while maintaining electrical connectivity.
3Reliability
If metal plates with grooves are exposed for electrical contact, then electrical performance improves, but manufacturing complexity increases
Solution Approach 1:
The metal plates with grooves are pre-formed and pre-positioned on the lead frame during lead frame fabrication, before chip assembly. The grooves are pre-cut or pre-formed with precise dimensions and orientations, and the metal plates are pre-bonded to the lead frame with predetermined alignment features. This preliminary preparation ensures high electrical contact quality without requiring complex alignment procedures during final assembly.
Solution Approach 2:
The grooves on the metal plates are designed to self-align with corresponding features on the chip or bonding pads through mechanical interference or geometric constraints. The lead frame structure itself provides alignment guidance, allowing the exposed metal plates to automatically position themselves correctly during assembly, thereby reducing the need for high-precision external alignment equipment and processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal dissipation and electrical performance while reducing parasitic inductance and resistance, thereby improving the overall efficiency and cost-effectiveness of semiconductor package production.
Implementation Method 1
a bottom of the chip is attached to a top face of the die pad by a conductive adhesive material
Implementation Method 2
an electrode of the chip is bonded with a lead of the lead frame by a bonding wire
Data Source
AI summary
A semiconductor package and it manufacturing method includes a lead frame having a die pad, and a source lead with substantially a V groove disposed on a top surface. A semiconductor chip disposed on the die pad. A metal plate connected to a top surface electrode of the chip having a bent extension terminated in the V groove in contact with at least one of the V groove sidewalls.