Exposed Conductive Unit Package Structure for Thermal Management

The patent extracts the heat dissipation function from the encapsulated conductive unit by exposing its second side. The encapsulation material covers only the first side of the conductive unit that connects to the substrate, while the second side remains exposed to facilitate heat dissipation. This selective exposure resolves the contradiction by maintaining device protection through encapsulation while preserving thermal management capabilities.

The patent replaces the mechanical wire bonding system with a direct flip chip connection system. Instead of using flexible wires to connect the die to the carrier, the die is bumped with conductive material and flipped to connect directly to the carrier. This substitution eliminates the long wire paths that cause high inductance, thereby improving signal and power transmission while maintaining manufacturing feasibility through automated bumping processes.

The patent inverts the traditional die attachment approach by flipping the die face-down for connection. Instead of bonding pads located at the edges of the die (requiring edge space), the connection pads are now at the bottom surface of the die, allowing the entire top surface to be used for active circuitry. This inversion eliminates the need for edge space, maximizing the usable die area and increasing signal density without increasing die size.