Exposed Core Package Design for Power Converter Thermal Management

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Solution Overview

Problem

Traditional encapsulated power converter assemblies face issues with thermal resistance, mechanical stress, and manufacturing inefficiencies due to the over-molding of inductive components, which can lead to blistering, void formation, and increased core losses.

Innovation Solution

The proposed solution involves an exposed core package design where the magnetic core surfaces are left unencapsulated, with large radii bends and gaps in the core structure to reduce flux concentration and eddy current losses, and a molding process that positions the core to maintain safety clearances and dielectric insulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the magnetic core is fully encapsulated with encapsulant, then mechanical protection and structural integrity are improved, but thermal performance deteriorates due to increased thermal resistance

Engineering Contradiction:
Improvemechanical protectionVSAvoidthermal performance
Core Design Contradiction:
StrengthVSTemperature

Solution Approach 1:

The patent applies local quality by selectively exposing specific portions of the magnetic core (such as the outer peripheral surface or flux path regions) while encapsulating other portions. This localized exposure strategy provides thermal management benefits at critical heat-generating areas while maintaining mechanical protection where needed, resolving the contradiction between full encapsulation protection and thermal performance.

Inventive Principle:
Principle #3Local quality

2Strength

If the encapsulant thickness is increased to provide better mechanical protection, then strength is improved, but manufacturing efficiency deteriorates due to longer curing times and increased complexity

Engineering Contradiction:
Improvemechanical protectionVSAvoidmanufacturing efficiency
Core Design Contradiction:
StrengthVSProductivity

Solution Approach 1:

The patent implements local quality by varying the encapsulant thickness across different regions of the magnetic core. Thinner encapsulant layers are applied in regions where full mechanical protection is less critical or where thermal exposure is desired, while thicker layers are used in regions requiring enhanced protection. This regional variation reduces overall curing time and manufacturing complexity while maintaining adequate mechanical protection.

Inventive Principle:
Principle #3Local quality

3Volume of moving object

If the core structure uses sharp corners and tight bends to maximize space utilization, then volume efficiency is improved, but core losses increase due to flux concentration and eddy currents

Engineering Contradiction:
Improvespace utilizationVSAvoidcore losses
Core Design Contradiction:
Volume of moving objectVSLoss of energy

Solution Approach 1:

The patent applies the curvature principle by designing the magnetic core with rounded corners and large radii bends instead of sharp angles and tight bends. This curvature modification reduces flux concentration and eddy current losses in the core while maintaining efficient space utilization. The rounded geometry smooths the flux distribution and eliminates high-stress concentration points, directly addressing the energy loss problem.

Inventive Principle:
Principle #14Spheroidality (Curvature)

4Reliability

If pre-baking processes are applied to the magnetic core before encapsulation, then reliability is improved by preventing blistering and void formation, but manufacturing complexity and cost increase

Engineering Contradiction:
Improvedefect preventionVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by performing moisture removal and defect prevention measures during the encapsulation process itself rather than requiring separate pre-baking steps. The encapsulation process is designed to accommodate moisture evacuation and prevent void formation inherently, eliminating the need for additional pre-baking equipment and process steps while maintaining high reliability and preventing blistering.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances thermal performance, reduces core losses, and eliminates the need for costly pre-baking processes, while improving manufacturing yield and efficiency by minimizing encapsulant thickness and mechanical stress on the core.

Implementation Method 1

The core structure can include a magnetically permeable material having a permeability to define the flux path

Methodology Applied
Scientific EffectMagnetic permeability: Ferromagnetism

Implementation Method 2

Encapsulation in this manner may aid in conducting heat out of the over-molded components

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9387633B1Encapsulation method for electronic modules
Publication Date: 2016.07.12 VI CHIP
  • US9387633B1 patent drawing
  • US9387633B1 patent drawing
  • US9387633B1 patent drawing

AI summary

An encapsulated electronic device includes a magnetically permeable core structure which is exposed within and coplanar with a flat top surface of the device. A bottom surface of the core may be exposed within the bottom surface of the device. The bottom core surface may be recessed beneath, coplanar with, or protruding from the bottom surface of the device. Alternatively the bottom surface may be encapsulated within the device. A method for manufacturing the exposed core package includes positioning a first component relative to a second component before encapsulating the device. An improved planar magnetic core structure includes internal bevels having a radius greater than or equal to 15% and preferably 25%, 35%, or as much as 50% of the core thickness to reduce concentration of the magnetic field around the internal corners.