Exposed-Die Double-Sided IC Module for Thinner Thermal Packaging
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Solution Overview
Problem
Existing double-sided IC modules face challenges in further reducing size and improving heat dissipation and connectivity due to encapsulation of semiconductor dies, limiting their integration in compact electronic devices.
Innovation Solution
A double-sided IC module design with exposed semiconductor dies, where a portion of the mold compound on the bottom side is removed to expose the semiconductor die surface, allowing for reduced thickness and enhanced heat transfer and electrical/magnetic connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If semiconductor dies are fully encapsulated by mold compound, then protection and structural integrity are improved, but module thickness cannot be reduced and heat dissipation is limited
Solution Approach 1:
The patent extracts the mold compound from specific regions to expose the semiconductor die surfaces. By selectively removing the encapsulant material, the invention achieves direct access to the die surfaces for heat dissipation and electrical connections while maintaining encapsulation in other areas for protection.
Solution Approach 2:
The patent applies different levels of encapsulation to different regions of the semiconductor die. Some surfaces remain exposed while other areas are covered by mold compound, creating local variations in protection and function. This allows simultaneous achievement of heat dissipation, electrical connectivity, and structural protection.
2Temperature
If semiconductor dies are fully encapsulated by mold compound, then environmental protection is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent removes mold compound from specific regions to create thermal pathways. By extracting the encapsulant material from areas where heat dissipation is critical, the invention enables direct thermal management while maintaining environmental protection in other regions.
Solution Approach 2:
The patent creates localized thermal management zones by selectively exposing semiconductor die surfaces in regions requiring heat dissipation while maintaining encapsulation in other areas. This local differentiation allows simultaneous achievement of thermal performance and environmental protection.
3Adaptability or versatility
If semiconductor dies are fully encapsulated by mold compound, then structural integrity is improved, but electrical and magnetic connectivity is limited
Solution Approach 1:
The patent extracts mold compound to expose semiconductor die surfaces that require electrical or magnetic connections. By removing the encapsulant in specific locations, the invention enables direct connectivity while maintaining structural integrity in encapsulated regions.
Solution Approach 2:
The patent creates localized connection zones by selectively exposing die surfaces in areas requiring electrical or magnetic connectivity while maintaining encapsulation elsewhere. This local differentiation enables versatile connectivity options while preserving overall structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The exposed semiconductor die surface facilitates heat dissipation and improved connectivity, reducing module thickness and enabling more compact electronic device designs.
Implementation Method 1
providing a surface to which a heat exchange device can be coupled (e.g., to transfer heat away from the semiconductor die)
Data Source
AI summary
The present disclosure relates to a double-sided integrated circuit (IC) module, which includes an exposed semiconductor die on a bottom side. A double-sided IC module includes a module substrate with a top side and a bottom side. Electronic components are mounted to each of the top side and the bottom side. Generally, the electronic components are encapsulated by a mold compound. In an exemplary aspect, a portion of the mold compound on the bottom side of the module substrate is removed, exposing a semiconductor die surface of at least one of the electronic components.