Exposed Die Pad Package Power Ring Thermal Dissipation
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Solution Overview
Problem
Semiconductor dice are fragile, prone to contamination, and sensitive to electrostatic discharge, making them difficult to handle and integrate into circuit boards, and traditional packaging methods like DIP and QFP limit connection density and thermal management.
Innovation Solution
A packaged semiconductor design featuring a conductive integral frame with a ring portion and a casing that supports the die, where sections connecting the inner and ring portions are removed to create a power ring and ground plane, allowing for improved electrical isolation and thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional packaging methods like DIP and QFP are used, then leads can be easily connected to circuit boards, but connection density is limited and thermal management is insufficient
Solution Approach 1:
The frame is segmented into multiple functional zones including a power ring portion, ground plane portions, and isolated sections. This segmentation allows independent optimization of power delivery, ground reference, and thermal management areas, enabling both high connection density and effective thermal management without interference between functions.
Solution Approach 2:
The patent transitions from traditional perimeter-based lead arrangements to a two-dimensional planar distribution of electrical connections across the frame surface. The power ring and ground planes are distributed throughout the frame area, maximizing connection density while providing direct thermal pathways to the circuit board.
2Ease of manufacture
If the die is exposed for wire bonding, then bond wires can connect the die to leads, but the die is vulnerable to contamination and electrostatic discharge
Solution Approach 1:
The die is mounted to the frame and wire-bonded while the frame is still open, allowing easy access for bonding operations. After bonding is complete, the encapsulant is molded to close and protect the die, preventing contamination and electrostatic discharge while preserving the electrical connections made during the open state.
Solution Approach 2:
The frame acts as an intermediary structure that provides both mechanical support and electrical connectivity during the wire bonding process. The conductive frame elements serve as intermediate connection points between the die bond pads and the final lead outputs, enabling manufacturing while protecting the die.
3Device complexity
If leads are located around the perimeter of the package, then the package structure is simple, but connection density is limited
Solution Approach 1:
The frame is divided into multiple functional segments including power ring portions, ground plane portions, and isolated sections distributed across the frame. This segmentation enables numerous connection points throughout the frame area rather than仅限于 perimeter, significantly increasing connection density while maintaining structural integrity.
Solution Approach 2:
The patent moves from one-dimensional perimeter lead placement to two-dimensional distribution of electrical connections across the entire frame surface. The power ring and ground planes are arranged in a planar configuration that maximizes the number of available connection points within the package footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances handling and integration by reducing the risk of contamination and electrostatic discharge, while enabling higher connection density and efficient thermal management through the separation of power and ground signals, leading to more reliable and efficient semiconductor packaging.
Implementation Method 1
Some QFN packages include a central pad on the second face that dissipates thermal energy from the package to the circuit board
Implementation Method 2
Sections of the conductive frame that connect the inner portion to the ring portion are removed after the casing is applied to the conductive frame
Data Source
AI summary
A packaged semiconductor is disclosed. The packaged semiconductor comprises a conductive integral frame that includes an inner portion and a ring portion encircling the inner portion, a semiconductor die that is mounted to a first surface of the inner portion of the conductive frame, and a casing that supports the conductive frame and covers the semiconductor die. Sections of the conductive frame that connect the inner portion to the ring portion are removed after the casing is applied to the conductive frame.