Exposed Semiconductor Laser Mount for Low-Cost Assembly

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Solution Overview

Problem

Conventional semiconductor laser modules are difficult to assemble and manufacture at a low cost due to the need for precise electrical and optical connections and alignment of components on the side wall of the housing, making them complex and costly to produce.

Innovation Solution

A laser device with a mount member exposing the semiconductor laser element's upper and lateral sides, allowing for easier electrical connection and optical alignment, and a light-source device with a base member for placing multiple laser devices, facilitating assembly and reducing manufacturing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the semiconductor laser element is housed in a housing with side wall mounting for electrodes and optical fibers, then electrical connection and optical alignment are achieved, but assembly complexity increases and manufacturing cost rises

Engineering Contradiction:

Improveelectrical connection and optical alignmentVSAvoidassembly complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Instead of mounting electrodes and optical fibers on the side wall of the housing, the patent inverts the approach by providing connection terminals and optical output units on the upper surface of the housing. The semiconductor laser element is mounted on an upper surface of a base, and connections are made from above rather than from the side, fundamentally changing the mounting topology to simplify assembly

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent extracts the semiconductor laser element from a fully enclosed housing structure and places it on an exposed upper surface of a base. This allows direct access to the element for electrical connection and optical alignment without requiring complex side-wall penetration and sealing structures, thereby reducing assembly complexity while maintaining connection reliability

Inventive Principle:

Principle #2Taking out (Extraction)

2Reliability

If the semiconductor laser element is housed in a housing with side wall mounting, then electrical connection is achieved, but manufacturing cost increases

Engineering Contradiction:

Improveelectrical connectionVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent inverts the mounting approach by placing connection terminals on the upper surface of the housing rather than on the side wall. This allows electrodes to be connected from above, eliminating the need for complex side-wall penetration structures and hermetic sealing, thereby reducing manufacturing cost while maintaining reliable electrical connection

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent employs a base structure with upper surface mounting that uses simpler, less expensive connection methods compared to side-wall hermetic sealing. The design accepts a less complex housing structure that is easier and cheaper to manufacture, while still achieving the necessary electrical and optical connections through the upper surface approach

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Manufacturing precision

If the optical element and semiconductor laser element are housed in the housing, then optical alignment is achieved, but assembly complexity increases

Engineering Contradiction:

Improveoptical alignmentVSAvoidassembly complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent extracts the optical alignment process from a enclosed housing environment and performs it on an exposed upper surface. The optical element is positioned to receive laser light from the semiconductor laser element on the upper surface, allowing for simpler alignment procedures without requiring complex side-wall openings and sealing structures

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of aligning optical components through side-wall openings in the housing, the patent inverts the approach by aligning the optical element and semiconductor laser element on the upper surface of the base. This allows direct optical path establishment from above, simplifying the alignment process while maintaining manufacturing precision

Inventive Principle:

Principle #13The other way round (Inversion)

4Reliability

If hermetic sealing is implemented for side wall mounting, then reliability is improved, but device complexity increases

Engineering Contradiction:

Improvehermetic sealingVSAvoidstructural complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the connection and optical output functions from the side wall structure, eliminating the need for hermetic sealing at the side walls. By placing terminals and optical units on the upper surface, the design removes the complex hermetic sealing requirement entirely, reducing structural complexity while maintaining reliability through alternative sealing approaches at the upper surface

Inventive Principle:

Principle #2Taking out (Extraction)

Data Source

PatentUS10985526B2Laser device and light-source device

Publication Date: 2021.04.20 FURUKAWA ELECTRIC CO LTD

AI summary

A laser device that is easily assembled and can be manufactured at a low cost and a light-source device using the same are provided. The laser device includes a mount member including a mount surface, and a semiconductor laser element placed on the mount surface of the mount member. An upper side and lateral sides of the semiconductor laser element on the mount surface are exposed.