Exposed-Layer Component Carrier for Protected Sensor Integration

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Solution Overview

Problem

Existing component carriers face challenges in providing mechanical robustness and electrical reliability, especially under harsh conditions, while accommodating increasingly miniaturized and powerful array-like components with tight spacing and exposed contacts.

Innovation Solution

A component carrier design with an exposed layer protected by adhesive layers on both sides, sandwiched between stack layers, allowing for precise manufacturing processes like laser cutting to form blind holes, ensuring mechanical protection and electrical connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If an exposed layer is provided in a component carrier to enable sensor/actuator functionality, then the functionality is extended, but the exposed layer becomes vulnerable to mechanical damage

Engineering Contradiction:

Improvesensor/actuator functionalityVSAvoidmechanical protection

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The component carrier is segmented into multiple functional layers including the exposed layer, adhesive layers, and stack layers. This segmentation allows the exposed layer to be isolated and protected by surrounding structural elements while maintaining its exposure for functionality.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The exposed layer is nested within the component carrier structure, surrounded by adhesive layers and stack layers. This nesting provides mechanical protection while allowing the exposed layer to maintain its exposure for sensor/actuator functionality.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Adaptability or versatility

If miniaturized array-like components with tight spacing are used to increase functionality, then product functionalities are enhanced, but manufacturing precision requirements increase

Engineering Contradiction:

Improveproduct functionalitiesVSAvoidcontact spacing

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

Different regions of the component carrier are assigned different functional qualities. The exposed layer provides local exposure for functionality, while surrounding adhesive and stack layers provide structural support and precision positioning for miniaturized components with tight spacing.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The exposed layer is prepared and positioned in advance within the component carrier structure, with adhesive layers applied to secure it. This preliminary action ensures precise positioning before miniaturized components are added, facilitating tight spacing requirements.

Inventive Principle:

Principle #10Preliminary action

3Adaptability or versatility

If the exposed layer is fully exposed to enable environmental interaction, then sensor functionality is improved, but mechanical robustness decreases

Engineering Contradiction:

Improveenvironmental interactionVSAvoidmechanical robustness

Core Design Contradiction:

Adaptability or versatilityVSStrength

Solution Approach 1:

The exposed layer has differentiated regions: an exposed portion for environmental interaction and covered portions for mechanical protection. This local quality differentiation allows the layer to simultaneously achieve sensor functionality and structural robustness.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The exposed layer is segmented into exposed and covered portions. The exposed portion enables environmental interaction for sensor functionality, while the covered portions provide mechanical protection, achieving both requirements simultaneously.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentEP3820258B1Component carrier with exposed layer

Publication Date: 2026.01.21 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AG

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AI summary

Component carrier (100) which comprises a stack (102) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (106), and a partially exposed layer (108) in a central region of the stack (102) being exposed with regard to an upper side (112) and a lower side (114) by a respective blind hole (116, 118) formed in the stack (102), wherein each of opposing main surfaces of the exposed layer (108) is partially covered by a respective adhesive layer (120, 122).