Semiconductor Package with Exposed Sensor Surfaces
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Solution Overview
Problem
Conventional semiconductor packaging methods result in large, expensive packages with poor quality, especially when packaging devices with cavities like sensors, and there is a need for a cost-effective solution that allows for integration of multiple devices in a single package to meet customer demands for smaller and smarter electronic products.
Innovation Solution
A method involving the use of protective films and coatings to singulate and attach devices to a substrate, followed by encapsulation and selective removal of encapsulants to expose device surfaces, allowing for the integration of devices with cavities without damaging them, and forming electrical contacts for external connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packaging methods are used, then devices can be packaged, but the package form factor becomes large and the quality deteriorates
Solution Approach 1:
The package structure is segmented into distinct functional zones: the encapsulant covers the back surface while leaving the front surface exposed, and the lead frame is divided into separate attachment and connection portions. This segmentation allows the sensor active surface to remain accessible while providing protective packaging for other components.
Solution Approach 2:
The front surface of the sensor is extracted from the encapsulated region, creating an exposed active surface that protrudes from the encapsulant. This extraction allows the sensor's critical surface to be accessible for its sensing function while the rest of the device remains protected.
2Reliability
If conventional packaging methods are used, then devices can be packaged, but the manufacturing cost increases
Solution Approach 1:
The sensor is pre-mounted on the lead frame before the encapsulant is applied. This preliminary action allows the sensor to be positioned and secured in its optimal orientation, ensuring high-quality connections while simplifying the subsequent encapsulation process and reducing overall manufacturing complexity.
Solution Approach 2:
Multiple functions are merged into a single integrated package structure: the lead frame serves as both the mechanical support and the electrical connection element, while the encapsulant provides both protection and structural integrity. This merging eliminates the need for separate components and reduces assembly steps.
3Reliability
If devices with cavities are packaged using conventional methods, then packaging is achieved, but the sensor quality becomes poor
Solution Approach 1:
The encapsulation is applied selectively to different regions of the sensor package with different properties: the back surface receives full encapsulation for protection, while the front surface remains exposed to maintain sensor functionality. This local differentiation of encapsulation quality preserves sensor performance while providing necessary protection.
Data Source
AI summary
A method of forming a semiconductor package includes forming a coating over a first device, attaching the first device to a substrate using an adhesive, encapsulating the first device using an encapsulant material, releasing the first device from the substrate using the adhesive, removing a portion of the encapsulant material that is over the first device to expose the coating, and removing the coating over the first device to expose a portion of the first device.