Exposed Side Wall Component Carrier Heat Dissipation
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Solution Overview
Problem
As electronic components on component carriers become more powerful and densely packed, efficient heat removal and mechanical robustness are increasingly challenging, while maintaining electrical reliability and functionality, especially under harsh conditions.
Innovation Solution
A component carrier is manufactured with a stack of electrically conductive and insulating layer structures, embedding components and exposing at least a portion of their side wall to enable functional connections and sensor applications, while maintaining mechanical protection and compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electronic components are densely packed with smaller spacing between contacts, then product functionality and miniaturization are improved, but heat removal becomes increasingly difficult
Solution Approach 1:
The patent exposes the lateral side walls of embedded components to provide additional heat dissipation surfaces. By utilizing the vertical/d lateral dimension rather than only horizontal spreading, the component carrier dissipates heat more effectively from densely packed components through their exposed side surfaces.
2Adaptability or versatility
If material is removed from the stack to expose component side walls, then functionality is enhanced, but mechanical robustness may be compromised
Solution Approach 1:
The patent selectively removes material only from specific regions to expose component side walls, while leaving the rest of the stack intact. This extraction approach provides the necessary functionality for lateral connections and heat dissipation while preserving the overall mechanical integrity of the component carrier structure.
3Volume of moving object
If components are embedded in the stack, then compact design is achieved, but access to side walls for connections is lost
Solution Approach 1:
The patent embeds components within the stacked layer structures to achieve compact vertical integration, then exposes their lateral side walls to provide access for electrical connections and other functionalities. This approach maintains the compact footprint while enabling lateral interfacing through the vertical dimension.
Data Source
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AI summary
A component carrier (100) which comprises a stack (102) comprising a plurality of electrically conductive layer structures (104) and/or electrically insulating layer structures (106), and a component (108) embedded in the stack (102), wherein at least a portion of a side wall (110) of the component (108) is exposed.