Exposed Solderable Semiconductor Package for Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As the number of semiconductor components in a single package increases, heat generation also rises, leading to potential heat accumulation that can adversely affect component performance, necessitating improved heat dissipation methods.
Innovation Solution
A semiconductor package design incorporating a first thermal conductive layer adjacent to an electronic component, a second thermal conductive layer with a smaller surface area exposed on the first layer, and a solderable element to enhance heat transfer and reduce manufacturing costs, utilizing thermal conductive materials like copper and solder, and forming these layers through cost-effective printing techniques to avoid damage and environmental concerns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor components are incorporated into a single package, then more functions are provided, but heat accumulation occurs which adversely affects component performance
Solution Approach 1:
The thermal conductive layer is divided into multiple separate parts rather than a single continuous layer. Each part corresponds to a specific electronic component, allowing independent heat dissipation paths for each component while maintaining electrical connection through the substrate.
Solution Approach 2:
The thermal conductive material is selectively applied only in regions where heat dissipation is needed, with different thermal conductive parts positioned adjacent to different electronic components. This localized approach optimizes heat dissipation where required while reducing material usage and cost.
2Temperature
If a thermal conductive layer is formed using conventional printing techniques, then heat dissipation is improved, but manufacturing cost increases and environmental damage occurs
Solution Approach 1:
The patent employs a cost-effective printing technique to form the thermal conductive layer using inexpensive thermal conductive paste containing metal particles suspended in a vehicle. This approach replaces expensive conventional techniques while achieving the required heat dissipation function.
Solution Approach 2:
The invention changes the material parameters by using a paste formulation with metal particles (such as aluminum, copper, or silver) in a vehicle that can be printed. The paste can be formulated with different metal particle sizes, concentrations, and types to optimize both heat dissipation performance and manufacturing cost.
3Temperature
If the thermal conductive layer covers the entire surface, then heat dissipation area is maximized, but electrical connection reliability decreases due to size deviations
Solution Approach 1:
The thermal conductive layer is segmented into multiple discrete parts rather than a single continuous layer. Each part is positioned adjacent to a specific electronic component, providing adequate heat dissipation area while maintaining precise alignment with corresponding electrical connection regions on the substrate.
Solution Approach 2:
The thermal conductive paste is selectively applied in specific regions adjacent to electronic components rather than covering the entire surface. This localized application ensures that heat dissipation occurs where needed while avoiding interference with electrical connection areas, thereby maintaining connection reliability despite manufacturing tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively improves heat dissipation by increasing the surface area for heat transfer while reducing manufacturing costs and environmental impact, and enhances electrical connector reliability by addressing size deviations and connection issues.
Implementation Method 1
a first thermal conductive layer 103 and a second thermal conductive layer 105a, 105b. The first thermal conductive layer 103 is disposed adjacent to a surface of the electronic component 101. The second thermal conductive layer 105a, 105b is disposed on the first thermal conductive layer 103
Data Source
AI summary
A semiconductor device, a semiconductor package, and a method of manufacturing the same are provided. The semiconductor device includes an electronic component, a first thermal conductive layer, a second thermal conductive layer, and a solderable element. The first thermal conductive layer is disposed adjacent to a surface of the electronic component. The second thermal conductive layer is disposed on the first thermal conductive layer and exposes a portion of the first thermal conductive layer. The solderable element is disposed on the second thermal conductive layer.