Exposed Submodule Sealing for Reusable Semiconductor Packages
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Solution Overview
Problem
Existing semiconductor devices with wholly sealed submodules make it difficult to reuse the submodules by complicating the extraction process.
Innovation Solution
The submodule is partially exposed by using a second sealing material that allows the upper surface to be accessible, enabling easy removal and reuse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the submodule is wholly sealed with sealing resin, then the insulation and protection of the submodule is improved, but the difficulty of taking out the submodule for reuse increases
Solution Approach 1:
The sealing structure is divided into two distinct parts: a first sealing material that completely seals the submodule for protection, and a second sealing material that seals only the peripheral region. This segmentation allows the submodule to be extracted by removing the second sealing material without damaging the first sealing material or the submodule itself.
Solution Approach 2:
The second sealing material is selectively removed from the peripheral region to enable extraction of the submodule. This extraction principle allows the submodule to be taken out for reuse while the first sealing material remains intact on the submodule for continued protection.
2Reliability
If the submodule is wholly sealed, then the protection of semiconductor elements is improved, but the cost of manufacturing increases due to inability to reuse
Solution Approach 1:
The second sealing material is designed to be removable and discarded, while the submodule with the first sealing material is recovered and reused. This allows expensive semiconductor elements to be reused multiple times, reducing overall manufacturing costs while maintaining protection through the first sealing material.
3Reliability
If the submodule is completely covered by sealing material, then the insulation performance is improved, but the complexity of the device increases
Solution Approach 1:
The sealing structure is segmented into two functional parts: the first sealing material for complete submodule sealing providing insulation, and the second sealing material for peripheral sealing that can be removed. This segmentation maintains insulation performance while reducing complexity by enabling selective removal of the second sealing material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy extraction and reuse of submodules, reducing environmental impact and manufacturing costs by allowing efficient recycling of expensive semiconductor elements.
Implementation Method 1
a conductive plate and a semiconductor element mounted to an upper surface of the conductive plate via a first bonding material are sealed with a first sealing material
Implementation Method 2
The insulating substrate is bonded to a lower surface of the submodule via a second bonding material
Implementation Method 3
a conductive plate and a semiconductor element mounted to an upper surface of the conductive plate via a first bonding material are sealed with a first sealing material
Implementation Method 4
The second sealing material seals a region surrounded by the case so that at least an upper surface of the submodule is exposed
Data Source
AI summary
An object is to provide a technique capable of easily taking out a submodule from a semiconductor device to reuse the submodule. The semiconductor device includes: a submodule in which a conductive plate and a semiconductor element mounted to an upper surface of the conductive plate via a first bonding material are sealed with a first sealing material; an insulating substrate bonded to a lower surface of the submodule via a second bonding material; a case surrounding a periphery of the insulating substrate and the submodule; and a second sealing material sealing a region surrounded by the case so that at least an upper surface of the submodule is exposed.