Exposed Thermally Conductive Coating for IC Package Thermal Dissipation
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Solution Overview
Problem
Integrated circuit packages face challenges with increased profile and poor thermal dissipation, which are critical issues in the competitive electronics market, where existing solutions have not provided effective answers.
Innovation Solution
An integrated circuit package system is designed with a coplanar leadframe and a thermally conductive coating that is singulated from a wafer level coating, exposed for thermal dissipation, and encapsulated in a way that maintains its exposure to enhance heat dissipation while maintaining a low profile.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the package encapsulates the die/substrate combination in a resin package, then environmental protection is provided, but thermal dissipation deteriorates
Solution Approach 1:
The patent applies local quality by exposing specific regions of the thermally conductive coating at the bottom surface of the package while encapsulating other areas with molding compound. This creates localized thermal pathways through the otherwise insulating resin package, allowing heat to dissipate from critical areas while maintaining environmental protection in encapsulated regions.
Solution Approach 2:
The patent uses composite materials by combining the thermally conductive coating (such as metal layers) with the electrically insulating and environmentally protective molding compound. This composite structure allows simultaneous achievement of thermal dissipation through the conductive coating and environmental protection through the encapsulating resin.
2Reliability
If the package uses traditional encapsulation, then environmental protection is provided, but package profile increases
Solution Approach 1:
The patent extracts the thermal management function from the bulk encapsulation material and implements it through the exposed thermally conductive coating at the package bottom. This separation allows the molding compound to focus on environmental protection while the conductive coating handles thermal dissipation, reducing the need for additional profile-height components.
3Temperature
If the thermally conductive coating is exposed, then thermal dissipation improves, but misalignment potential increases
Solution Approach 1:
The patent applies preliminary action by forming the thermally conductive coating on the wafer before dicing and bonding operations. This early formation ensures the coating is already in its final position relative to the die, eliminating subsequent alignment steps and reducing misalignment potential during later manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves thermal dissipation, reduces package profile, increases reliability, and reduces the potential for misalignment during surface mount, thereby enhancing the performance and longevity of integrated circuit packages.
Implementation Method 1
thermally conductive coating that is coplanar with the bottom surface of the integrated circuit package system... exposed for thermal dissipation
Data Source
AI summary
An integrated circuit package system includes providing a leadframe that is coplanar with a bottom surface of the integrated circuit package system to which is attached a device with a thermally conductive coating that is coplanar with the bottom surface of the integrated circuit package system to the leadframe, the device having the characteristics of being singulated from a wafer and the thermally conductive coating having the characteristics of being singulated from a wafer level thermally conductive coating and encapsulating the device with an encapsulation material that leaves the thermally conductive coating exposed for thermal dissipation.