Exposure Apparatus Alignment Using Digital Coordinate System
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Solution Overview
Problem
The increasing size of LCD panel substrates necessitates a more efficient and cost-effective method for aligning exposure apparatuses without optical masks, as traditional photolithography methods are expensive and error-prone, especially when dealing with large substrates.
Innovation Solution
A method and apparatus for aligning exposure apparatuses using a digital mode, where a reference coordinate system is established by assigning origin and center point coordinates to microscopes and exposure heads, with beam position detection marks, allowing for accurate substrate alignment and exposure without the need for expensive photo masks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional photolithography method using photo masks is used, then manufacturing precision is maintained, but manufacturing cost increases and management complexity increases for large substrates
Solution Approach 1:
The patent replaces physical photo masks with digital mask data that is transferred to a digital micromirror device (DMD). The DMD creates optical copies of the circuit patterns by selectively reflecting light through microlenses, eliminating the need for expensive physical photo masks while maintaining pattern fidelity for large substrates
Solution Approach 2:
The patent substitutes the mechanical photo mask system with a digital optical system consisting of DMD, microlens array, and coordinate alignment mechanisms. This replacement eliminates physical mask handling, reduces manufacturing costs, and enables flexible digital pattern generation for large-area substrates
2Ease of manufacture
If digital exposure method is used to reduce photo mask usage, then manufacturing cost decreases, but coordinate alignment precision becomes more critical and difficult to achieve
Solution Approach 1:
The patent performs preliminary coordinate alignment by detecting alignment marks on the substrate before the actual exposure process. The system establishes a coordinate system based on these marks and pre-calculates the positioning requirements for the DMD and substrate stage, ensuring precise alignment is achieved before exposure begins
Solution Approach 2:
The patent employs feedback mechanisms where the position detection apparatus continuously monitors the substrate and DMD positions during exposure. The system uses alignment mark detection and real-time position feedback to adjust and maintain coordinate alignment precision throughout the digital exposure process
3Area of stationary object
If photo masks are used for large substrates, then exposure coverage is sufficient, but the number of masks required increases and management complexity increases
Solution Approach 1:
The patent implements a universal digital mask system where a single DMD device can generate any circuit pattern through digital data. This multi-functional system replaces multiple physical photo masks, allowing the same hardware to expose different patterns on large substrates without requiring additional physical masks or complex mask management
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise and efficient alignment of exposure apparatuses, reducing alignment errors and costs by allowing the use of a digital mode for exposing photoresist films on large substrates, thereby improving the exposure process efficiency and quality.
Implementation Method 1
a laser beam for exposing the photoresist film
Data Source
AI summary
An origin of a reference coordinate system is assigned to one of a plurality of center points, and center point coordinates according to the reference coordinate system are assigned to remaining center points, so that reference marks successively correspond to center points of a plurality of microscopes fixed to a base. Beam position detection marks disposed between the reference marks with exposure points of exposure heads fixed to the base are crossed to assign beam coordinates according to the reference coordinate system to the exposure points. Thus, alignment may be easily and accurately performed, and is effective for increasingly larger apparatuses.


