Exposure Apparatus Parallel Wiring Pattern Generation
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Solution Overview
Problem
Current methods for forming rewiring layers in FO-WLP and FO-PLP semiconductor packages face challenges in improving throughput due to inefficiencies in measuring and generating wiring patterns for connecting semiconductor chips.
Innovation Solution
An exposure apparatus equipped with a spatial light modulator and a data generation unit that measures chip positions, determines wiring patterns, generates control data, and stores it for controlling the spatial light modulator, allowing simultaneous exposure processing on a different substrate, thereby improving throughput by parallel processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If measurement and wiring pattern generation are performed sequentially before exposure processing, then measurement precision and wiring accuracy are ensured, but productivity is reduced due to sequential processing time
Solution Approach 1:
The system performs measurement of chip positions and generation of wiring patterns in advance during the exposure processing of a first substrate. This preliminary action allows the measurement and data generation to be completed before the exposure processing of a second substrate begins, ensuring precision requirements are met while enabling parallel processing to improve productivity.
Solution Approach 2:
The system maintains continuous useful action by overlapping the measurement and wiring pattern generation processes with the exposure processing of a different substrate. Instead of idle time during measurement and data generation, the system continuously performs exposure processing on another substrate, eliminating downtime and improving overall throughput.
2Productivity
If multiple substrates are processed in parallel, then productivity is improved through increased throughput, but device complexity increases due to coordination of multiple processing streams
Solution Approach 1:
The system segments the processing into distinct functional units: a first substrate processing unit for exposure, and a second substrate processing unit for measurement and wiring pattern generation. This segmentation allows independent operation of each unit while maintaining overall system coordination, reducing the complexity burden compared to fully integrated parallel processing.
Solution Approach 2:
The system uses an intermediary data storage and transfer mechanism between the measurement system and the exposure processing unit. The wiring pattern data generated during first substrate exposure is stored and then transferred to control the spatial light modulator for second substrate exposure, acting as an intermediary buffer that simplifies coordination between parallel processing streams.
3Manufacturing precision
If wiring pattern data is generated and stored for subsequent exposure, then manufacturing precision is maintained through data accuracy, but loss of time occurs during data storage and retrieval operations
Solution Approach 1:
The system performs preliminary generation and storage of wiring pattern data during the exposure processing of a first substrate. By completing the data generation in advance and storing it in readiness, the system eliminates the need for time-consuming data generation during the critical exposure phase of the second substrate, thus reducing time loss while maintaining data accuracy.
Solution Approach 2:
The data storage and retrieval operations are performed continuously during the exposure processing of the first substrate rather than as separate discrete operations. This continuous action minimizes idle time and ensures that data is ready for immediate use when the second substrate exposure begins, reducing overall time loss while maintaining manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the throughput in forming wiring patterns by effectively utilizing the time required for exposure processing to measure and generate wiring pattern data, ensuring accurate connections between semiconductor chips.
Implementation Method 1
an exposure apparatus including: a spatial light modulator; a generation unit configured to acquire a measurement result from a measurement system that measures positions of semiconductor chips included in each of sets of the semiconductor chips arranged on a first substrate, determine a wiring pattern that connects the semiconductor chips included in each of the sets based on the measurement result, generate first control data used for control of the spatial light modulator in generating the determined wiring pattern
Data Source
AI summary
An exposure apparatus includes a spatial light modulator (SLM), a generation unit that acquires a measurement result from a measurement system measuring positions of semiconductor chips arranged on a first substrate, determines a wiring connecting the semiconductor chips based on the measurement result, generates control data used for control of the SLM in generating the determined wiring pattern, and stores the control data in a storage unit, and an exposure processing unit that controls the SLM using the control data stored in the storage unit and exposes the wiring pattern, wherein at least one of measurement of the positions of the semiconductor chips on the first substrate, acquisition of the measurement result, determination of the wiring pattern, generation of the control data, or storage of the control data is executed while the exposure processing unit is performing exposure processing on a second substrate different from the first substrate.