Semiconductor Exposure Equipment Modeling for Wafer Output Evaluation
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Solution Overview
Problem
The integration of EUV exposure technology in semiconductor manufacturing poses challenges in operating and improving productivity due to difficulties in verifying equipment parameters and process management.
Innovation Solution
An electronic device equipped with a communication circuit, processor, and memory automates the evaluation of semiconductor exposure equipment performance by integrating data from an external database, generating predictive models for wafer production, and analyzing causes of loss to optimize equipment operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If EUV exposure equipment is introduced with new process items, then manufacturing capability is enhanced, but verification of equipment parameters becomes difficult and operation complexity increases
Solution Approach 1:
The system automatically collects equipment data from multiple sources, performs integrated analysis, and generates performance evaluations without requiring manual verification of equipment parameters. The automated model generation and loss analysis enable the system to self-evaluate and identify improvement opportunities, reducing operational complexity while maintaining enhanced manufacturing capability
Solution Approach 2:
The patent introduces an intermediary electronic device that acts as a bridge between the complex EUV exposure equipment and operators. This intermediary system consolidates data from various equipment components, processes it through integrated models, and presents simplified performance insights, thereby managing the complexity of new process items while preserving manufacturing capabilities
2Measurement precision
If manual evaluation of equipment performance is performed, then operational control is maintained, but time consumption increases and automation level remains low
Solution Approach 1:
The patent replaces manual mechanical evaluation processes with an automated information processing system. The electronic device automatically collects equipment data, integrates it with process parameters, generates predictive models, and performs loss analysis without human intervention, thereby maintaining measurement precision while dramatically reducing evaluation time and increasing automation
Solution Approach 2:
The system creates a virtual model (copy) of the equipment performance through data integration and modeling. Instead of manual physical evaluation, the electronic device generates a digital representation of equipment status and performance trends, enabling rapid automated analysis that preserves accuracy while eliminating time-consuming manual processes
3Measurement precision
If comprehensive equipment data is collected and integrated, then analysis accuracy is improved, but data processing complexity increases
Solution Approach 1:
The patent merges multiple data sources including equipment operational data, process parameters, and performance metrics into a single integrated dataset. The electronic device consolidates these diverse data streams and processes them through unified models, improving analysis accuracy while managing complexity through systematic data integration rather than separate processing of each data type
Solution Approach 2:
The electronic device performs multiple functions within a single system: data collection from various sources, data integration, model generation, performance evaluation, and loss analysis. This multi-functional approach handles comprehensive equipment data effectively, improving analysis accuracy while avoiding the complexity of multiple separate processing systems
Data Source
AI summary
An electronic device including a communication circuit, at least one processor, and at least one memory configured to store instructions, the at least one memory and instructions configured to, with the at least one processor, cause the electronic device to: receive equipment data of a semiconductor exposure equipment from an external database through the communication circuit, generate integrated data that integrates the equipment data by wafer and equipment model, generate a model that predicts daily wafer production of the semiconductor exposure equipment based on process time of the semiconductor exposure equipment for a wafer using the integrated data, the process time including wafer swap time for each equipment, lot swap time for each equipment, and exposure time for each equipment, and evaluate performance of the semiconductor exposure equipment based on the generated model.