Exposure Head Chip Layout for Accurate LED Mounting
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Solution Overview
Problem
Existing exposure heads in electrophotographic printers face challenges in maintaining the accuracy of the mounting position of light emitting chips on the substrate, leading to potential gaps in light exposure on the photosensitive member.
Innovation Solution
The exposure head design includes a staggered pattern arrangement of light emitting chips on the substrate, with adhesive application ensuring that protruding areas do not overlap the chips, and uses chip alignment marks for precise mounting, along with a rod lens array for efficient light collection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is applied to bond the substrate and light emitting chip, then bonding strength is improved, but the adhesive may overlap with the light emitting chip causing mounting position deviation
Solution Approach 1:
The adhesive application area is designed with non-uniform distribution: a first protruding area on one side of the light emitting chip and a second protruding area on the opposite side, where the first area is larger than the second area. This local variation in adhesive distribution provides sufficient bonding strength while preventing overlap with the chip body, thus maintaining mounting position accuracy.
Solution Approach 2:
The adhesive protruding areas are designed asymmetrically, with the first protruding area being larger than the second protruding area. This asymmetric configuration optimizes both bonding performance and positional accuracy by distributing adhesive material unevenly around the chip, ensuring strong adhesion without compromising mounting precision.
2Area of stationary object
If light emitting chips are arranged in a staggered pattern, then light exposure coverage is improved, but mounting position accuracy becomes more difficult to maintain
Solution Approach 1:
The staggered arrangement creates different local conditions for adjacent chips. By configuring different sizes of protruding adhesive areas (first larger than second) for chips in different positions, the patent ensures that each chip achieves optimal bonding and positioning according to its specific location in the staggered pattern, maintaining both coverage and precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the risk of light exposure gaps and enhances light collection efficiency, maintaining accurate image formation even with minor deviations in chip mounting positions.
Implementation Method 1
an adhesive configured to bond the substrate and the light emitting chip
Implementation Method 2
light emitting elements such as light emitting diodes (LEDs) or organic electroluminescence (EL) elements to form a latent image
Implementation Method 3
a rod lens array for efficient light collection
Data Source
AI summary
When mounting a plurality of light emitting chips on a substrate, there is a risk that adhesive protruding from a light emitting chip comes into contact with an adjacent light emitting chip and affects mounting position accuracy of the light emitting chip with respect to the substrate. The adhesive that bonds the substrate and the light emitting chip includes a protruding area that does not overlap with the light emitting chip, viewed from a direction perpendicular to a surface of the substrate. The protruding area includes a first protruding area located on one side and a second protruding area located on the other side with respect to the light emitting chip in a transverse direction of the substrate. The first protruding area may be larger than the second protruding area.