Exposure Head Dual-Adhesive Bonding for Optical Alignment Stability
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Solution Overview
Problem
Existing technologies fail to efficiently remove elemental mercury (Hg0) from flue gas and oxidized mercury (Hg2+) from waste liquid, with activated carbon injection technology being costly and its mercury removal efficiency is affected by NOx and SO2.
Innovation Solution
Utilization of metal sulfides (e.g., FeS2, CuS, CuFeS2) as mercury removal adsorbents, which contact with flue gas and waste liquid, adsorbing and converting Hg0 from flue gas and Hg2+ from waste liquid into stable mercury sulfide compounds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single adhesive is used to bond the board and lens array to the housing, then the manufacturing process is simple, but the board may displace during curing leading to deterioration of optical performance
Solution Approach 1:
The adhesive bonding process is divided into two distinct stages: first applying a low-viscosity adhesive to achieve initial positioning and temporary fixation, then applying a high-viscosity adhesive to provide strong final bonding. This segmentation of the adhesive function prevents board displacement during curing while maintaining manufacturing simplicity.
Solution Approach 2:
The low-viscosity adhesive is applied first to perform the preliminary action of securing the board and lens array in their correct positions before the high-viscosity adhesive is applied. This preliminary positioning action prevents displacement during the subsequent curing process of the first adhesive and before the second adhesive fully cures.
2Strength
If a high elastic modulus adhesive is used, then bonding strength is high, but displacement during curing cannot be suppressed
Solution Approach 1:
The adhesive system transitions from a dynamic, flexible state (low-viscosity adhesive allowing slight movement) to a rigid, stable state (high-viscosity adhesive providing strong bonding). The first adhesive maintains flexibility during curing to prevent displacement, while the second adhesive provides the necessary strength once positioning is complete.
Solution Approach 2:
The invention changes the viscosity parameter of the adhesive system by using two different adhesives with distinct viscosity characteristics. The first adhesive has low viscosity to allow positioning adjustment, while the second adhesive has high viscosity to provide strong final bonding, thus resolving the contradiction between bonding strength and positioning stability.
3Stability of the object's composition
If the board is firmly bonded to the housing, then structural stability is high, but optical performance deteriorates due to displacement
Solution Approach 1:
Positioning precision is achieved as a preliminary action before final bonding. The low-viscosity adhesive allows the board to be precisely positioned and temporarily fixed, ensuring manufacturing precision. Subsequently, the high-viscosity adhesive is applied to achieve firm bonding and structural stability without compromising the previously achieved positioning accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves efficient, cost-effective, and environmentally friendly simultaneous removal of Hg0 from flue gas and Hg2+ from waste liquid, avoiding secondary pollution and reducing operational costs.
Implementation Method 1
a first adhesive configured to make the housing and the board adhere to each other, the first adhesive being cured at a first rate and having a cured elastic modulus of a first elastic modulus; and a second adhesive configured to make the housing and the board adhere to each other
Data Source
AI summary
An exposure head includes: a light emitting chip including a plurality of light emitting portions arranged in a rotational axis direction of a photosensitive member and configured to emit light to expose the photosensitive member; a board on which the light emitting chip is mounted; a lens configured to condense the light emitted by the light emitting chip onto a surface of the photosensitive member; a housing configured to hold the board and the lens; a first adhesive configured to make the housing and the board adhere to each other, the first adhesive being cured at a first rate and having a cured elastic modulus of a first elastic modulus; and a second adhesive configured to make the housing and the board adhere to each other, the second adhesive being cured at a second rate and having a cured elastic modulus of a second elastic modulus, in which the second rate is higher than the first rate, and the first elastic modulus is higher than the second elastic modulus.