Exposure Apparatus Shot Region Distortion Correction

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Solution Overview

Problem

In semiconductor exposure apparatuses, correcting distortion in shot regions on wafers is time-consuming, reducing throughput, and divided exposure further complicates calculations, leading to decreased efficiency.

Innovation Solution

An exposure apparatus that determines whether to perform one-shot or divided exposure for each shot region based on shape information, controlling the exposure process to optimize the correction of partial regions and reduce position deviation, thereby improving throughput.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If divided exposure is performed to correct distortion in shot regions, then alignment precision is improved, but throughput is reduced due to increased calculation complexity and measurement time

Engineering Contradiction:
Improvealignment precisionVSAvoidthroughput
Core Design Contradiction:
Measurement precisionVSProductivity

Solution Approach 1:

The invention segments the shot regions into multiple sub-regions based on distortion characteristics, applying divided exposure only to regions that require it. This selective segmentation allows correction of distortion in specific areas while maintaining faster exposure speeds in regions where distortion is minimal or already corrected, thereby balancing precision improvement with throughput maintenance.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention applies different exposure strategies to different shot regions based on their individual distortion characteristics. Regions with significant distortion undergo divided exposure with detailed shape calculations, while regions with minimal distortion use standard one-shot exposure. This local differentiation optimizes the balance between correction precision and processing speed for each specific region.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If measurement of alignment marks is performed for all shot regions to correct distortion, then shape correction accuracy is improved, but measurement time increases significantly

Engineering Contradiction:
Improveshape correction accuracyVSAvoidmeasurement time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The invention divides the measurement process into selective segments, measuring alignment marks only in shot regions where distortion exceeds predetermined thresholds. This selective measurement approach ensures accurate shape correction where needed while skipping measurements in regions where distortion is already within acceptable tolerances, significantly reducing total measurement time.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention performs preliminary assessment of distortion characteristics for each shot region before initiating full measurement and correction procedures. By pre-evaluating which regions require detailed measurement and correction, the system avoids unnecessary measurement time in regions that do not require correction, while ensuring comprehensive measurement where needed.

Inventive Principle:
Principle #10Preliminary action

3Measurement precision

If divided exposure is applied to correct distortion, then position deviation is reduced, but calculation complexity increases

Engineering Contradiction:
Improveposition deviationVSAvoidcalculation complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The invention segments the calculation process into region-specific computations, calculating precise shape parameters only for shot regions that require correction. By dividing the overall calculation task into smaller, targeted computations rather than performing comprehensive calculations for all regions, the system reduces total computational complexity while maintaining high position deviation correction accuracy where needed.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS9575413B2Exposure apparatus, exposure method, and device manufacturing method
Publication Date: 2017.02.21 CANON KK
  • US9575413B2 patent drawing
  • US9575413B2 patent drawing
  • US9575413B2 patent drawing

AI summary

An exposure apparatus sequentially performs exposure in each of a plurality of underlying shot regions formed on a substrate and includes a controller. The controller is configured to judge, for each of the plurality of shot regions, whether to perform one-shot exposure without dividing the shot region or divided exposure, based on information of respective shapes of the plurality of shot regions, determine a shape of each partial region in the shot region in which the divided exposure is to be performed, and control the exposure so as to perform the one-shot exposure or the divided exposure in each of the plurality of shot regions based on a result of the judgment and the determined shape of each partial region.