Extendable Heat Dissipation Member for Variable System Sizes

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Solution Overview

Problem

Conventional heat dissipation apparatuses have limited flexibility and applicability due to fixed dimensions, which affects heat dissipation efficiency in systems of varying sizes, leading to potential device failure from excessive heat accumulation.

Innovation Solution

An extendable heat dissipation apparatus with a base, an extendable heat dissipation member, and a connecting element that allows the heat dissipation member to be extended and adjusted, utilizing spare space within the system, and incorporating a CPU fan for enhanced convection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the heat dissipation apparatus uses a fixed dimension and surface area, then the structure is simple and easy to manufacture, but the heat dissipation efficiency varies slightly between computer systems of different sizes

Engineering Contradiction:
Improvestructure simplicityVSAvoidheat dissipation efficiency adaptability
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The heat dissipation apparatus employs an extendable heat dissipation member that can dynamically adjust its length between a first length and a second length. This dynamic adjustment capability allows the apparatus to adapt to different computer system sizes (ATX, AT, and other form factors) while maintaining effective heat dissipation performance, resolving the contradiction between structural simplicity and adaptability.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The apparatus changes the physical parameter of the heat dissipation member's length to adapt to different system dimensions. By extending or retracting the heat dissipation member, the surface area available for heat dissipation is adjusted according to the available space in different computer case configurations, thereby improving heat dissipation efficiency across various system sizes without complicating the basic structure.

Inventive Principle:
Principle #35Parameter changes

2Area of stationary object

If the heat dissipation apparatus enlarges the scale to increase heat dissipative area, then the heat dissipation efficiency is improved, but the applicability becomes specific and limited

Engineering Contradiction:
Improveheat dissipative areaVSAvoidsystem compatibility
Core Design Contradiction:
Area of stationary objectVSAdaptability or versatility

Solution Approach 1:

The heat dissipation member is designed to be extendable between a first length and a second length, allowing the heat dissipative area to be dynamically adjusted. This enables the apparatus to achieve larger heat dissipative area when needed (improving heat dissipation efficiency) while maintaining compatibility with different system sizes through the ability to retract to a smaller configuration, thus resolving the contradiction between area enlargement and system compatibility.

Inventive Principle:
Principle #15Dynamics

3Device complexity

If the heat dissipation apparatus uses constant dimension relative to system volume, then the structure is simple, but the heat dissipation efficiency varies between systems of different dimensions

Engineering Contradiction:
Improveapparatus structureVSAvoidheat dissipation efficiency
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

The extendable heat dissipation member provides a relatively simple structural solution that allows the apparatus to adjust its dimensions based on the system volume and available space. This dynamic adjustment capability enables the heat dissipation efficiency to be optimized for different system sizes (ATX, AT, and other form factors) without significantly complicating the overall apparatus structure.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus effectively increases the heat dissipation area and efficiency by utilizing spare space, improving operational stability and adaptability across different system dimensions.

Implementation Method 1

A heat pipe may also be used to improve heat transfer efficiency

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

obtain an advantageous convection by airflow from a CPU fan in the space

Methodology Applied
Scientific EffectForced convection: Forced Convection

Data Source

PatentUS7411791B2Extendable heat dissipation apparatus
Publication Date: 2008.08.12 ASUSTEK COMPUTER INC
  • US7411791B2 patent drawing
  • US7411791B2 patent drawing
  • US7411791B2 patent drawing

AI summary

An extendable heat dissipation apparatus includes a base, an extendable heat dissipation member and a connecting element. A normal fin is formed on the base, and the connecting element integrates the extendable heat dissipation member in the apparatus with the base. The extendable heat dissipation member can be extendable to an extending location and can also be stored in a storing location with respect to the base.