Extended Conductive Pathways for Flexible Topside Interconnects
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Solution Overview
Problem
Conventional package-on-package architectures are limited in flexibility for topside interconnect arrangements, restricting the placement and size of interconnects, and often require large solder balls, excluding the use of micro bumps or surface activated bonding.
Innovation Solution
The implementation of extended conductive pathways, such as through silicon vias, combined with conductive pads and routing on a mold compound, allows for customizable topside package interconnects, enabling the placement of contact pads anywhere on the top side and supporting smaller, more flexible interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional package-on-package architectures are used, then the structure is simple and manufacturing is straightforward, but the flexibility for topside interconnect arrangements is limited and large solder balls are required
Solution Approach 1:
The patent extends conductive pathways from the back side of the die through the mold compound to the top side, adding a vertical dimension to interconnect routing. This allows interconnects to be placed anywhere on the top surface rather than being constrained to peripheral locations, significantly increasing design flexibility without requiring complex lateral routing
Solution Approach 2:
The mold compound serves as an intermediary medium that contains embedded conductive pathways. These pathways act as mediators between the die and external interconnects, enabling flexible routing options while maintaining a simple overall package structure. The intermediary conductive paths decouple the physical location of interconnects from the die bonding locations
2Quantity of substance
If large solder balls are used for interconnects, then mechanical strength is sufficient, but the number of interconnects that can be placed is reduced and micro bumps cannot be used
Solution Approach 1:
By routing conductive pathways vertically through the mold compound rather than laterally across the package substrate, the patent enables placement of multiple interconnects within the die footprint area. This vertical routing approach increases the density of interconnects that can be accommodated without compromising mechanical strength, as each pathway is independently supported through the mold compound
Solution Approach 2:
The patent changes the physical parameters of interconnects by enabling the use of smaller diameter conductors (micro bumps, surface activated bonding) through the extended pathway architecture. The distributed support structure of the mold compound with embedded pathways allows smaller interconnects to maintain sufficient mechanical strength while increasing the total number of interconnects that can be placed on the package assembly
3Adaptability or versatility
If interconnects are placed only at peripheral locations, then manufacturing is simplified, but the location and size of interconnects cannot be customized
Solution Approach 1:
The conductive pathways are pre-formed and embedded within the mold compound before the die is attached to the package substrate. This preliminary action of creating the conductive routing infrastructure in advance allows for flexible interconnect placement locations without increasing manufacturing complexity, as the pathways are already in position to receive interconnects at any location on the top surface
Data Source
AI summary
Integrated circuit (IC) structures with extended conductive pathways, as well as related structures, devices, and methods, are disclosed herein. For example, in some embodiments, an IC structure may include a die having a device side and an opposing back side; a mold compound disposed at the back side; and a conductive pathway extending into the die from the back side and extending into the mold compound from the back side.