Extended Copper Ground Layer DIMM Cooling
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Solution Overview
Problem
The increasing number of dual inline memory modules (DIMMs) on server boards, combined with smaller form factors, makes it difficult to effectively cool DIMMs due to reduced air gaps and thicker heat spreaders, limiting cooling capability and DIMM performance.
Innovation Solution
Implementing an extended copper ground layer on the PCB that acts as a heat sink, forming an air gap to enhance heat transfer and using a connection adaptor to maintain compatibility with standard DIMM connectors, allowing for thinner DIMMs with improved cooling without altering the existing layout.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the number of DIMMs on the board is increased to match CPU performance, then the system memory capacity and bandwidth are improved, but the air gap between DIMMs is reduced making cooling difficult
Solution Approach 1:
The patent combines the ground layer and heat sink into a single integrated structure. The extended ground layer serves dual purposes: providing electrical grounding and acting as a thermal conduction path to dissipate heat from DIMMs. This merging eliminates the need for separate thermal interference materials and simplifies the cooling solution while maintaining effective heat dissipation in dense DIMM configurations.
Solution Approach 2:
The extended ground layer performs multiple functions simultaneously: it provides electrical grounding for signal integrity, acts as a heat sink for thermal management, and serves as a structural element for mounting DIMMs. This multi-functionality resolves the contradiction by addressing both electrical and thermal requirements through a single design element.
2Volume of moving object
If the form factor is reduced for denser system design, then the system density is improved, but the heat spreader thickness must be increased which limits cooling capability
Solution Approach 1:
The patent extends the ground layer in the horizontal plane rather than increasing vertical thickness. By utilizing the lateral dimension of the PCB, the design achieves effective heat spreading area without compromising the vertical clearance needed for cooling airflow. This dimensional approach allows dense packing while maintaining cooling capability.
3Length of moving object
If thinner DIMMs are used to achieve compact designs, then the form factor is reduced, but additional thermal interference materials are required which increase complexity
Solution Approach 1:
The patent extracts the thermal management function from separate thermal interference materials and integrates it into the PCB ground layer itself. By removing the need for additional thermal materials, the design achieves compact DIMM thickness without increasing device complexity. The ground layer alone provides sufficient thermal conduction for effective cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables higher power support and bandwidth for DIMMs while reducing thermal resistance and impedance, allowing for more compact designs without the need for additional thermal interference materials, thus enhancing overall system cooling efficiency.
Implementation Method 1
Implementing an extended copper ground layer on the PCB that acts as a heat sink, forming an air gap to enhance heat transfer
Implementation Method 2
forming an air gap to enhance heat transfer
Implementation Method 3
forming an air gap to enhance heat transfer
Data Source
AI summary
Aspects of the embodiments are directed to a printed circuit board (PCB) that includes a conductive layer extending from the printed circuit board to act as a heat sink for circuit components electrically and mechanically attached to the PCB. The conductive layer can be a copper ground layer of a multi-layered PCB. The PCB can include one or more circuit components, such as dynamic random access memory elements. In embodiments, the PCB is part of a dual inline memory module. The conductive layer can be fashioned such that it extends out from the PCB and returns over the circuit elements to define an air gap between the conductive layer and the surface of the PCB and/or the surface of the circuit elements. In embodiments, a connection adaptor can be used to accommodate various PCB thicknesses so that the PCB can be electrically connected to an edge connector.