Extended Head Bump Pillar Capacitor Integration for Compact Chips
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Solution Overview
Problem
Microelectronic devices operating at high frequencies face challenges in integrating capacitors without significantly increasing device size due to the space requirements of capacitors.
Innovation Solution
The integration of electrically conductive pillars and extended heads in microelectronic devices, where the pillars are mechanically coupled to a connection surface and the extended heads form a bump pad and a capacitor plate, allowing for concurrent formation to minimize space usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If capacitors are integrated into microelectronic devices, then performance is improved, but device size increases
Solution Approach 1:
The patent merges the capacitor structure with existing microelectronic device components by using pillars and extended heads that are concurrently formed with the device architecture. The capacitor plates are integrated into the bump pad structure, combining multiple functions into a unified design that eliminates the need for separate capacitor components.
Solution Approach 2:
The extended head structure serves dual purposes: it provides the bump pad for electrical connection and simultaneously forms the capacitor plate. This multi-functional design allows the same structural element to fulfill both interconnection and energy storage functions, thereby integrating capacitance without adding extra device area.
2Reliability
If capacitors are closely integrated with microelectronic devices, then performance is improved, but manufacturing complexity increases
Solution Approach 1:
The capacitor structure is preliminarily formed during the concurrent fabrication process of the microelectronic device. The pillars and extended heads are formed simultaneously with the device architecture through integrated manufacturing steps, avoiding the need for separate capacitor fabrication and assembly operations.
Solution Approach 2:
The manufacturing processes for the capacitor components are merged with the existing device fabrication workflow. The same patterning, deposition, and etching steps that create the device interconnects also form the capacitor plates and dielectric structures, reducing overall process complexity.
Data Source
AI summary
A microelectronic device has a die with a first electrically conductive pillar, and a second electrically conductive pillar, mechanically coupled to the die. The microelectronic device includes a first electrically conductive extended head electrically coupled to the first pillar, and a second electrically conductive extended head electrically coupled to the second pillar. The first pillar and the second pillar have equal compositions of electrically conductive material, as a result of being formed concurrently. Similarly, the first extended head and the second extended head have equal compositions of electrically conductive material, as a result of being formed concurrently. The first extended head provides a bump pad, and the second extended head provides at least a portion of a first plate of an integrated capacitor. A second plate may be located in the die, between the first plate and the die, or on an opposite of the first plate from the die.