Extended Lower Source/Drain Structure for Buried Stacked FET Contacts

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Solution Overview

Problem

Forming contacts to the lower source/drain (S/D) in stacked field-effect transistors (FETs) is challenging due to its burial underneath the top S/D, making existing contact formation methods ineffective.

Innovation Solution

A lower S/D is epitaxially grown over an active channel stack and a dummy stack, with the dummy stack subsequently removed, leaving a dummy stub, enabling a double-wide lower S/D to electrically connect to a lower S/D contact metalized over the stub.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If a stacked FET structure is used to achieve 3D monolithic integration and area reduction, then device density and area efficiency are improved, but forming contacts to the lower source/drain becomes increasingly difficult

Engineering Contradiction:
Improvedevice areaVSAvoidcontact formation
Core Design Contradiction:
Area of moving objectVSEase of manufacture

Solution Approach 1:

A dummy stack is formed adjacent to the active channel stack before growing the lower source/drain. The dummy stack serves as a placeholder that enables the lower source/drain to be grown in a laterally extended configuration. After the lower source/drain is formed, the dummy stack is removed, leaving a dummy stub that maintains the extended structure. This preliminary action of adding the dummy stack allows contact formation to proceed effectively.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The dummy stack acts as an intermediary structure during the fabrication process. It provides the necessary space and structural support for growing the lower source/drain in an extended configuration that would not be possible with the active channel stack alone. The dummy stack mediates between the need for compact 3D integration and the need for accessible lower source/drain contacts.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If the lower source/drain is grown only over the active channel stack, then device structure is simplified, but the lower source/drain cannot be effectively contacted due to burial underneath the top S/D

Engineering Contradiction:
ImprovestructureVSAvoidelectrical connection
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The lower source/drain is grown to extend laterally in a direction perpendicular to the active channel stack, utilizing the lateral dimension provided by the adjacent dummy stack. This lateral extension creates an accessible surface for contact formation, transforming the lower source/drain from a completely buried structure to one that is partially exposed through the lateral extension over the dummy stub.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If a laterally extended lower source/drain is grown over both active channel stack and dummy stack, then effective electrical connection to lower S/D is enabled, but additional fabrication steps and structure are required

Engineering Contradiction:
Improveelectrical connectionVSAvoidfabrication process
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The dummy stack is temporarily added to enable the formation of the laterally extended lower source/drain, then removed after serving its purpose. The removal leaves a dummy stub that maintains the lateral extension of the lower source/drain. This approach allows the dummy stack to be discarded after fulfilling its intermediary function, recovering the space while preserving the beneficial extended structure for contact formation.

Inventive Principle:
Principle #34Discarding and recovering

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Facilitates effective electrical connection to the lower S/D, allowing signal conveyance to the active lower FET, thereby overcoming the challenge of reaching buried contacts in stacked FET devices.

Implementation Method 1

growing a lower source/drain (S/D) across the active channel stack and the dummy stack

Methodology Applied
Scientific EffectEpitaxial growth: Epitaxy

Data Source

PatentUS12563796B2Extended lower source/drain for stacked field-effect transistor
Publication Date: 2026.02.24 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US12563796B2 patent drawing
  • US12563796B2 patent drawing
  • US12563796B2 patent drawing

AI summary

Embodiments herein include semiconductor structures with an active channel stack having an upper field-effect transistor (FET) and a lower FET vertically stacked below the upper FET The semiconductor structure may also include a dummy stub adjacent to the active channel stack, a lower source/drain (S/D) connected to the active channel stack and laterally extended over the dummy stub, and an upper S/D connected to the active channel stack above the lower S/D.