Extended Stiffener Structure for Warpage-Controlled Semiconductor Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Advanced 2.5D electronic semiconductor packages with silicon interposers face mechanical warpage issues due to asymmetrical form-factors of electrical components, which are not adequately addressed by existing solutions that rely on dummy dies, leading to I/O routing obstructions and device miniaturization limitations.
Innovation Solution
A semiconductor package design that includes a stiffener with a main portion affixed to the package substrate and an extension portion extending over the electrical components, providing mechanical strength and balancing the profile to improve warpage control, while eliminating the need for dummy chiplets and enhancing I/O routing density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If dummy dies are used to balance the profile and control warpage, then mechanical warpage control is improved, but I/O routing is obstructed and device miniaturization is limited
Solution Approach 1:
The patent extracts the warpage control function from the dummy die concept and implements it through a dedicated stiffener structure. The stiffener is a separate component that can be strategically positioned to balance the profile without occupying functional areas needed for I/O routing, thus separating the warpage control function from the I/O routing space.
Solution Approach 2:
The stiffener acts as an intermediary element between the asymmetrical electrical components and the package substrate. It provides mechanical support and profile balancing without directly interfering with the I/O routing paths, serving as a mediator that solves the warpage issue while preserving routing functionality.
2Stability of the object's composition
If dummy dies are used to balance the profile, then mechanical warpage control is improved, but assembly time increases
Solution Approach 1:
The patent combines the warpage control function with the existing package substrate structure by integrating the stiffener into the substrate design. This merging eliminates the need for separate dummy die components and their associated assembly steps, reducing overall assembly time while maintaining profile balancing functionality.
Solution Approach 2:
The stiffener structure serves multiple functions simultaneously: it provides mechanical support, balances the profile, controls warpage, and does not interfere with I/O routing. This multi-functionality eliminates the need for separate dummy dies that would only serve the warpage control function, thereby simplifying the assembly process.
3Volume of moving object
If electrical components have asymmetrical form-factors to achieve miniaturization, then device size is reduced, but mechanical warpage increases
Solution Approach 1:
The patent embraces the asymmetry of the electrical components for miniaturization purposes and compensates for the resulting warpage through a strategically designed stiffener structure. The stiffener is positioned and dimensioned to counterbalance the asymmetrical load distribution, allowing the package to maintain both compact size and mechanical stability.
Solution Approach 2:
The stiffener functions as a counterweight structure that offsets the mechanical imbalance caused by asymmetrical electrical components. By strategically positioning the stiffener, the patent creates a counterbalancing effect that neutralizes the warpage tendencies arising from the asymmetrical component layout, enabling both miniaturization and stability.
Data Source
AI summary
A semiconductor package including: a package substrate including a base die disposed on a top surface of the package substrate, the base die including a plurality of electrical components disposed on a top surface of the base die, the plurality of electrical components including a first electrical component configured adjacent to a second electrical component, wherein the first electrical component and the second electrical component have an asymmetric form-factor; and a stiffener including: a stiffener main portion, wherein the stiffener main portion is affixed to the top surface of the package substrate and configured at least partially surrounding the base die; and a stiffener extension portion configured to extend from the stiffener main portion to be disposed at least partially over the top surface of the base die adjacent to the first electrical component and the second electrical component.