Extensible Conductor Interconnection via Intermediate Insulating Layer
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Solution Overview
Problem
Establishing a stable electrical connection between intrinsically extensible conductors and non-extensible conductors, particularly in biomedical implants, is challenging due to mechanical strains and deformations, which traditional solutions fail to address effectively, especially when both conductors have different elastic moduli and require miniaturization.
Innovation Solution
A system comprising a non-extensible interconnection board with conductive tracks and an elastic, extensible substrate separated by an adhesive and electrically insulating material, allowing for relative motion and ensuring stable contact through an optional elastic, conductive adhesive layer, distributing mechanical stress across a larger area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional connection methods are used between rigid/flexible conductors and intrinsically extensible conductors, then the connection structure is simple, but the connection fails under mechanical strains including longitudinal deformations
Solution Approach 1:
The patent introduces an intermediate connection structure comprising a first connection element attached to the rigid/flexible conductor and a second connection element attached to the intrinsically extensible conductor, with a connection region between them. This intermediary structure distributes mechanical stresses and accommodates both transverse and longitudinal deformations, preventing direct stress concentration at the conductor interface while maintaining electrical connectivity.
Solution Approach 2:
The connection structure utilizes materials and geometries with varying mechanical properties along its length. The first connection element has properties matched to rigid/flexible conductors, while the second connection element has properties matched to intrinsically extensible conductors. This gradual parameter change allows smooth stress transfer and accommodates the different deformation modes without creating stress concentration points.
2Volume of moving object
If the connection area is reduced to minimize device size, then the device achieves miniaturization, but stress concentration increases leading to connection failure
Solution Approach 1:
The connection structure extends in multiple dimensions rather than being confined to a single plane. The first and second connection elements can have three-dimensional geometries that distribute stress across multiple spatial dimensions. This dimensional expansion allows the connection to maintain adequate strength while occupying minimal projected area, enabling device miniaturization without sacrificing connection reliability.
Solution Approach 2:
The connection elements are designed to nest within each other or within the device housing. The first connection element can be positioned within or adjacent to the second connection element, creating a compact nested arrangement. This nesting approach maximizes the use of available space, allowing the connection structure to achieve adequate strength through optimized geometry rather than increased size.
3Reliability
If the connection structure is made robust to withstand mechanical strains, then connection reliability improves, but the device complexity and size increase
Solution Approach 1:
Different regions of the connection structure have locally optimized properties. The first connection element has mechanical properties optimized for rigid/flexible conductor interfaces, while the second connection element has properties optimized for intrinsically extensible conductor interfaces. The connection region between them has graded properties that facilitate stress transfer. This local quality approach achieves robustness through targeted optimization rather than uniform over-engineering, maintaining simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system maintains stable electrical contact under various mechanical stresses, including shear and torque, and allows for efficient interconnection of multiple contacts in a compact footprint, suitable for biomedical devices like neuromodulation electrodes.
Implementation Method 1
at least one deposit of an adhesive and electrically insulating material, interposed between the interconnection board and elastic and extensible substrate, which adheres to said functionalized faces
Implementation Method 2
conductors have been studied and are still under development, which as well as being flexible are intrinsically extensible, i.e. able to undergo (reversible) lengthening
Data Source
AI summary
A system is described for obtaining the electrical interconnection between an intrinsically extensible conductor (120) and a not intrinsically extensible one (110), or between two intrinsically extensible conductors. The system is particularly applied in the production of devices implantable in the human or animal body, highly conformable and deformable, for neurostimulation and/or neurorecording.