Extensible Heat Dissipation Structure for Variable Height Sources
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Solution Overview
Problem
Conventional heat dissipation structures, such as heat pipes and vapor chambers, have fixed sizes, making them inconvenient for use in electronic devices with heat sources of varying heights, as they cannot be easily adapted to different positions and sizes.
Innovation Solution
A heat dissipation structure with an extensible portion that can be extended, compressed, and bent, featuring a main body with an upper and lower plate, an extensible portion, and a chamber filled with a working fluid, allowing for adjustable length and flexibility to accommodate various electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional heat pipes or vapor chambers with fixed sizes are used, then the heat dissipation structure is simple in design, but it cannot adapt to heat sources of different positions and heights, reducing versatility
Solution Approach 1:
The heat dissipation structure incorporates an extensible portion that can dynamically change its length through extension and compression, allowing the overall length to be adjusted according to different heat source positions and heights. This dynamic adjustment capability enables the same heat dissipation device to adapt to various application scenarios without requiring multiple fixed-size components.
2Adaptability or versatility
If fixed-size heat dissipation structures are used for different electronic devices, then manufacturing and design are simplified, but the same structure cannot be commonly used across different devices, increasing inventory complexity
Solution Approach 1:
The heat dissipation structure is designed with an extensible portion that enables a single device to serve multiple functions and accommodate different electronic devices with varying heat source configurations. By adjusting the extension or compression of the extensible portion, the same heat dissipation device can be universally applied to different devices, eliminating the need for multiple specialized components and simplifying inventory management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables diversified use and convenient application across different electronic devices by allowing the heat dissipation structure to adapt to different heights and positions, enhancing its usability and effectiveness.
Implementation Method 1
A main body capillary structure is disposed in the chamber. The main body capillary structure is disposed on an inner wall of the chamber.
Implementation Method 2
One end of the heat pipe absorbs the heat to convert the internal working fluid from liquid phase to vapor phase so as to transfer the heat to the other end of the heat pipe
Implementation Method 3
The vapor chamber mainly works in such a manner that a plane face of the vapor chamber in contact with the heat source absorbs the heat and the heat is transferred to the other face of the vapor chamber by the internal working fluid. Then the working fluid is condensed to dissipate the heat.
Implementation Method 4
The extensible portion can be extended or compressed to change the length (or height) of the main body and can be freely bent or deformed.
Data Source
AI summary
A heat dissipation structure includes a main body. The main body has an upper plate, a lower plate, an extensible portion and a chamber. The upper plate, the extensible portion and the lower plate together define the chamber. The extensible portion is disposed between the upper and lower plates. A main body capillary structure is disposed in the chamber. The main body capillary structure is disposed on an inner wall of the chamber. A working fluid is filled in the chamber.