Extensible Mounting Board With Hard Resin Cutout

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing mounting boards lack extensible and contractible properties, leading to stress concentration and potential disconnection or resistance increase in wiring lines when attached to a living body, as they extend and contract.

Innovation Solution

An extensible and contractible mounting board with a substrate, wiring lines, and a hard resin portion that overlaps the wiring lines, featuring a cutout portion to reduce stress and prevent disconnection and resistance increase, where the hard resin's Young's modulus is higher than the substrate's.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the mounting board is made extensible and contractible to follow living body movement, then adaptability is improved, but stress concentration in wiring line connection regions increases leading to disconnection or resistance increase

Engineering Contradiction:
Improveextensibility and contractibilityVSAvoidwiring line connection reliability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent introduces a hard resin portion with different mechanical properties (higher Young's modulus) at the specific location of the wiring line connection region. This creates local quality differentiation where the mounting board has extensible properties in general but rigid support at critical connection points, resolving the contradiction between overall adaptability and local reliability

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent combines the extensible substrate material with a hard resin portion to create a composite structure. This composite approach allows the mounting board to exhibit both extensibility (from the substrate) and stress resistance (from the hard resin portion), simultaneously achieving adaptability and wiring line connection reliability

Inventive Principle:
Principle #40Composite materials

2Reliability

If the hard resin portion completely covers the wiring line for maximum protection, then reliability is improved, but the wiring line cannot extend and contract freely causing stress concentration

Engineering Contradiction:
Improvewiring line connection reliabilityVSAvoidextensibility and contractibility
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The hard resin portion is segmented with a cutout that divides it into regions, allowing the wiring line to pass through freely. This segmentation enables the wiring line to maintain extensibility while the hard resin provides protective coverage at critical connection points, resolving the contradiction between reliability and adaptability

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A cutout portion is extracted from the hard resin portion to create a passage for the wiring line. This allows the wiring line to extend and contract freely through the hard resin portion without being completely enclosed, maintaining both protection and flexibility

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS12016117B2Extensible and contractible mounting board
Publication Date: 2024.06.18 MURATA MFG CO LTD
  • US12016117B2 patent drawing
  • US12016117B2 patent drawing
  • US12016117B2 patent drawing

AI summary

An extensible and contractible mounting board that includes an extensible and contractible substrate; an extensible and contractible wiring line on one main surface of the extensible and contractible substrate; an electronic component electrically connected to the extensible and contractible wiring line; and a resin portion in contact with the extensible and contractible wiring line and overlapping an end portion of a connection region between the extensible and contractible wiring line and the electronic component in a plan view of the extensible and contractible mounting board, the resin portion having a cutout portion that overlaps the extensible and contractible wiring line. A Young's modulus of the resin portion is higher than a Young's modulus of the extensible and contractible substrate.