External Air Mover for Compact Computer Cooling

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Solution Overview

Problem

High-power, compact computer systems generate excessive heat, challenging current air-cooled systems that rely on airflow to dissipate heat effectively, especially in dense data center environments where ambient air temperature increases reduce cooling efficiency.

Innovation Solution

The system employs an externally mounted air mover and air director to create high flow rate, high static pressure airflow through the chassis, with varying exhaust port sizes and configurations to optimize cooling, and utilizes exhaust ducts to isolate and redirect warm air away from the cooling intake, potentially directing it to CRAC or outside the data center.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If air-cooled systems use fans to move air through compact computer chassis, then heat dissipation is achieved, but the cooling effectiveness decreases when ambient air temperature increases

Engineering Contradiction:
Improveheat dissipation capabilityVSAvoidcooling effectiveness
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent extracts the air moving function from internal fans and relocates it to an external air mover device. This external device draws cool air from outside the data center environment and directs it through the computer chassis, bypassing the heated ambient air that reduces cooling effectiveness. The external air mover is positioned to intake air from a location with lower temperature than the data center ambient air.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces an external air mover as an intermediary device between the external environment and the computer chassis. This intermediary component creates a separate air supply pathway that is independent of the data center's ambient air temperature, thereby maintaining consistent cooling effectiveness regardless of internal heat accumulation.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Volume of moving object

If computer systems are packaged in compact designs with components in close proximity, then space utilization improves, but airflow restriction increases reducing cooling capacity

Engineering Contradiction:
Improvesystem sizeVSAvoidcooling capacity
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The patent removes the air moving function from within the compact chassis to an external device. This extraction allows the internal chassis space to be fully utilized for computational components without needing to allocate space for large fans or complex internal airflow management systems, while still achieving effective cooling through the external air mover.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent shifts the airflow generation from a three-dimensional internal fan system to an external device that creates airflow along a different dimensional pathway. The external air mover draws air from outside the chassis and pushes it through the component array, creating an external-to-internal airflow path that efficiently navigates the compact component layout without requiring internal fan space.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Power

If high power components are used to increase computational power, then processing capability improves, but heat generation increases challenging cooling systems

Engineering Contradiction:
Improvecomputational powerVSAvoidheat generation
Core Design Contradiction:
PowerVSTemperature

Solution Approach 1:

The patent extracts the heat removal function from the computational components by using an external air mover. This separation allows the high-power components to operate without being constrained by internal cooling limitations, as the external device provides dedicated high-volume airflow specifically for heat dissipation without interfering with component placement or power density.

Inventive Principle:
Principle #2Taking out (Extraction)

4Temperature

If internal fans are used for air cooling, then heat dissipation is achieved, but noise levels increase

Engineering Contradiction:
Improveheat dissipationVSAvoidnoise
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent removes the noise-generating fans from inside the computer chassis and relocates them to an external air mover device. This extraction places the noise source outside the immediate workspace, reducing the perceived noise level for users while maintaining the same heat dissipation performance. The external device can be positioned in a location where noise is less problematic.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances cooling capacity, reduces noise, and allows for denser data center layouts by isolating and managing heat exhaust, improving overall cooling efficiency and reducing the need for heavy AC systems.

Implementation Method 1

Air-cooled systems often utilize an array of fans to move air from the environment, through a computer chassis, and back to the environment

Methodology Applied
Scientific EffectForced Convection: Forced Convection

Implementation Method 2

As the air passes through the enclosure it comes in thermal contact with, and absorbs heat from, the heat generating components within the enclosure

Methodology Applied
Scientific EffectHeat Absorption: Absorption (physical)

Data Source

PatentUS7382613B2Computer system with external air mover
Publication Date: 2008.06.03 HEWLETT PACKARD ENTERPRISE DEV LP
  • US7382613B2 patent drawing
  • US7382613B2 patent drawing
  • US7382613B2 patent drawing

AI summary

A computer system comprising a chassis supporting a processor, memory, and a power supply. An inlet allows air to flow into the chassis and an outlet allows air to flow out of the chassis. An air mover is operable to generate an airflow through said chassis between the inlet and the outlet and in thermal communication with the processor, memory, and power supply. The air mover is disposed external to said chassis.