External Auxiliary Heat Dissipation Device Loop Pathway
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic systems face challenges in effectively dissipating heat generated by heat-generating sources, as conventional water block heat-dissipating structures are limited in their ability to efficiently guide heat away from the source.
Innovation Solution
An external auxiliary heat dissipation device is introduced, comprising an external connection head module, a fluid driving module, a heat dissipation module, and pipes that form a loop fluid pathway with an internal connection head module, allowing for efficient heat transfer and dissipation through a closed loop system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional water block heat-dissipating structure is used, then the structure is simple and easy to manufacture, but the heat dissipation efficiency is limited and cannot effectively guide heat away from the heat-generating source
Solution Approach 1:
The heat dissipation system is divided into multiple independent modules: water block module, radiator module, pump module, and connection tubes. Each module can be manufactured separately and assembled to form a complete liquid cooling system, resolving the contradiction between manufacturing simplicity and heat dissipation efficiency
Solution Approach 2:
The patent implements a liquid cooling system using water or other cooling fluids circulating through closed-loop pipes to transfer heat from the heat-generating source through the water block to the radiator, where heat is dissipated to the environment. This hydraulic approach significantly improves heat dissipation efficiency compared to conventional air cooling while maintaining reasonable manufacturing complexity
2Reliability
If an external auxiliary heat dissipation device is added to improve cooling performance, then heat dissipation efficiency is improved, but the device complexity increases
Solution Approach 1:
The patent combines the water block, radiator, pump, and connection tubes into an integrated liquid cooling system that works as a unified whole. The external auxiliary heat dissipation device merges with the internal water block structure through connection tubes, creating a coordinated system that improves heat dissipation efficiency while managing overall device complexity through functional integration
Solution Approach 2:
The liquid cooling system serves multiple functions: the water block provides both structural support and heat transfer surface, the circulation system provides both cooling and potential lubrication, and the radiator serves both heat dissipation and system pressure regulation. This multi-functionality reduces the need for separate dedicated components, managing complexity while maintaining high heat dissipation efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The external auxiliary heat dissipation device enhances heat dissipation efficiency by creating a loop fluid pathway that connects the external and internal heat dissipation systems, effectively guiding heat away from the electronic device, thereby improving cooling performance.
Implementation Method 1
heat is transmitted from the heat-generating source to the heat-dissipating fins
Implementation Method 2
cooling liquids that circulate between the water inlet and the water outlet
Implementation Method 3
the heat of the first heat-dissipating fins can be guided away quickly by cooling liquids that circulate between the water inlet and the water outlet
Data Source
AI summary
An external auxiliary heat dissipation device includes an external connection head module, a fluid driving module, a heat dissipation module, and a plurality of first pipes. The external connection head module includes a first carrier body and at least two first fluid connection disposed on the first carrier body. The first pipes connect to the first fluid connection head, the fluid driving module, and the heat dissipation module to form a first fluid pathway. The electronic system includes an internal connection head module and a plurality of second pipes. The second pipes connect to the internal connection head module to form a second fluid pathway. The internal connection head module is detachably connected to the external connection head module, so that the first and the second fluid pathways are in fluid communication with each other to form a loop fluid pathway.