External Electrical Contacts for Light Emitter Submounts
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Solution Overview
Problem
Conventional light emitter components, such as LEDs, require complex and costly processing to embed electrical contacts within the submount, increasing production time and cost, and limiting efficiency in electrical and thermal connections.
Innovation Solution
The development of light emitter components with improved electrical contacts that are completely external to the submount, allowing for easier manufacturing and efficient electrical and thermal connections by exposing conductive vias or thru-holes on the external surfaces, enabling wraparound contacts that cover multiple sides of the submount.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrical contacts are embedded within the submount via molding or internal conductive vias, then reliable electrical connection is achieved, but processing time and manufacturing cost increase
Solution Approach 1:
The patent extracts the electrical contacts from the internal structure of the submount and positions them externally on the top surface. This eliminates the need for complex embedding processes and internal conductive vias, significantly reducing manufacturing steps and processing time while maintaining reliable electrical connection through direct contact with the LED chip
2Reliability
If electrical contacts are embedded within the submount via molding or internal conductive vias, then reliable electrical connection is achieved, but manufacturing cost increases
Solution Approach 1:
By extracting electrical contacts from the internal submount structure and placing them externally, the patent eliminates expensive embedding processes and internal via formation steps, directly reducing manufacturing complexity and cost while preserving connection reliability
Solution Approach 2:
The patent separates the electrical contact function from the submount body, allowing independent optimization of each component. This segmentation enables simpler, more cost-effective manufacturing of both the submount and the electrical contacts separately
3Productivity
If electrical contacts are completely external from the submount, then processing time and cost are reduced, but electrical and thermal connection efficiency may be compromised
Solution Approach 1:
The patent transitions electrical contacts from internal three-dimensional embedding to external two-dimensional surface placement. This dimensional change maintains connection efficiency by providing direct contact with the LED chip while dramatically simplifying the manufacturing process and reducing processing steps
Data Source
AI summary
Light emitter components and methods having improved electrical contacts and related methods are disclosed. In one embodiment, a light emitter component can include a submount, at least one light emitter chip on the submount, and at least one electrical contact disposed along portions of at least three external surfaces of the submount. The at least one electrical contact can be electrically connected to the at least one light emitter chip.