External Electrode Structure for Mountable Magnetic Components
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Solution Overview
Problem
Existing electronic components face challenges in achieving high close-contact strength between the element body and the bottom surface portion of the external electrode, which can lead to decreased mountability due to air entrapment issues during mounting on a mounting board.
Innovation Solution
The electronic component design includes a resin electrode with a conductive filler on the bottom surface portion, which enhances close-contact strength and mountability by improving the interface between the element body and the external electrode, while the use of a plating electrode for the end and bottom surface portions ensures reliable connectivity and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the bottom surface of the element body is roughened to improve close-contact strength, then the close-contact strength between the element body and the bottom surface portion of the external electrode is improved, but air entrapment occurs during mounting that decreases mountability
Solution Approach 1:
The patent applies different surface treatments to different regions of the element body: the end surfaces are roughened (Ra≥0.5μm) to enhance close-contact strength with the end surface portions of external electrodes, while the bottom surface is kept smooth (Ra<0.5μm) to prevent air entrapment during mounting. This local differentiation of surface properties resolves the contradiction between achieving high bond strength and ensuring good mountability.
2Reliability
If the end surface portion of the external electrode is made of conductor paste to achieve good electrical connection, then the electrical connectivity is improved, but the mechanical strength and close-contact strength are insufficient
Solution Approach 1:
The patent employs a composite electrode structure where the end surface portion consists of both conductor paste (for electrical connectivity) and sintered metal powder (for mechanical strength). This composite configuration allows the electrode to simultaneously achieve good electrical connection properties and enhanced mechanical bonding strength with the element body.
3Strength
If a resin electrode with conductive filler is used for the bottom surface portion, then close-contact strength is improved without air entrapment, but the electrical conductivity may be reduced
Solution Approach 1:
The patent assigns different functional requirements to different portions of the external electrode: the end surface portion uses conductor paste and sintered metal for both electrical and mechanical performance, while the bottom surface portion uses resin electrode with conductive filler primarily for mechanical bonding and positioning. This local functional differentiation allows the bottom surface to provide strong contact without air entrapment while maintaining sufficient electrical conductivity through the conductive filler.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves high close-contact strength and excellent mountability by improving the interface between the element body and the external electrode, reducing air entrapment and enhancing mechanical strength, thus improving solder wettability and loadability.
Implementation Method 1
The first bottom surface portion is a resin electrode containing a resin and a conductive filler
Data Source
AI summary
An electronic component including an element body having a magnetic body; an internal electrode embedded in the element body and whose end portion is exposed from an end surface of the element body; and an external electrode on an outer surface of the element body. The external electrode has a bottom surface portion on a bottom surface of the element body, and an end surface portion extending to an end surface of the element body that intersects perpendicularly with the bottom surface. The end surface portion is connected to the internal electrode exposed from the end surface. The bottom surface portion includes a first bottom surface portion arranged on the element body side, and a second bottom surface portion arranged on an outer side of the first bottom surface portion. The first bottom surface portion is a resin electrode containing a resin and a conductive filler.