External Heat Pipe Mounting for Compact Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heat pipes in electronic devices occupy significant space, interfering with internal components and compromising thermal management, especially in devices where compactness is crucial.
Innovation Solution
An electronic device design featuring a heat pipe mounted within a groove on the cover of the housing, allowing direct thermal communication with electrical components while maintaining a sealed and compact structure, utilizing thermally conductive materials and heat-dissipating fins to efficiently dissipate heat without disrupting electromagnetic interference shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat pipe is used to transfer heat from one location to another, then thermal management is improved, but the heat pipe takes up a relatively large amount of space and interferes with internal components
Solution Approach 1:
The patent extracts the heat pipe from the internal space of the electronic device and relocates it to an external position on the housing. The heat pipe is mounted on the exterior surface of the housing, allowing it to perform thermal management functions without occupying internal space that would be needed for other electronic components.
Solution Approach 2:
The heat pipe is transitioned from a three-dimensional internal component to a two-dimensional external surface-mounted element. By placing the heat pipe on the exterior housing surface, the design utilizes the external surface area rather than internal volume, effectively moving the thermal management function to another dimensional plane.
2Volume of moving object
If the heat pipe is mounted externally on the cover, then internal space is preserved, but the heat pipe must extend through the cover which may compromise sealing
Solution Approach 1:
The patent introduces a sealant or sealing material as an intermediary substance between the heat pipe and the cover opening. This sealant fills the interface gap where the heat pipe penetrates the cover, preventing moisture and contaminants from entering the internal cavity while allowing the heat pipe to maintain thermal communication with external heat dissipation surfaces.
Solution Approach 2:
The sealing solution employs a flexible sealing mechanism that can accommodate the heat pipe's presence in the cover opening. This may include flexible gaskets or conformal sealants that adapt to the heat pipe's geometry while maintaining the hermetic seal of the enclosure.
3Temperature
If the heat pipe extends into the opening to contact the electrical component, then direct thermal communication is achieved, but electromagnetic interference shielding may be disrupted
Solution Approach 1:
The patent segments the heat pipe structure into distinct functional zones: an internal portion that contacts the electrical component for heat absorption, an external portion mounted on the housing for heat dissipation, and an isolated section that passes through the cover opening without compromising the EMI shield. This segmentation allows thermal communication while maintaining electromagnetic shielding integrity.
Solution Approach 2:
The patent introduces an intermediary barrier or isolation structure at the cover opening where the heat pipe passes through. This intermediary element prevents direct electrical or electromagnetic connection between the internal circuitry and the external heat pipe, thereby maintaining EMI shielding while allowing thermal energy transfer through the heat pipe's physical presence.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat in electronic devices by uniformly spreading heat across the housing, maintaining lower temperatures for electrical components and improving net heat capacity without increasing device size, while ensuring sealing and non-interference with EMI shielding.
Implementation Method 1
a heat pipe mounted to the cover. A portion of the heat pipe extends into the opening of the cover to thermally communicate with the electrical component
Implementation Method 2
thermally communicate with the electrical component
Implementation Method 3
Heat pipes, however, take up a relatively large amount of space
Implementation Method 4
utilizing thermally conductive materials and heat-dissipating fins to efficiently dissipate heat
Implementation Method 5
heat-dissipating fins to efficiently dissipate heat
Data Source
AI summary
An electronic device including a housing having a container and a cover. The cover has an opening. The electronic device also includes a circuit board positioned within the container. The circuit board includes an electrical component that is aligned with the opening. The electronic device further includes a heat pipe mounted to the cover. A portion of the heat pipe extends into the opening of the cover to thermally communicate with the electrical component.