External Liquid-Cooling Disconnects for Leak Control

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Solution Overview

Problem

Conventional liquid cooling systems for computing devices, such as modular servers and information handling systems, face challenges in achieving high heat capture rates while maintaining serviceability and minimizing leak points, as internal disconnects can lead to damage and increased maintenance complexity.

Innovation Solution

The computing system employs external disconnects for liquid cooling, eliminating internal connections and using drip bibs to catch any stray fluid, thereby preventing leaks and enhancing serviceability by ensuring all connections are outside the housing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If internal disconnects are used in liquid cooling systems, then serviceability is improved, but the risk of fluid leakage and damage increases

Engineering Contradiction:
ImproveserviceabilityVSAvoidfluid leakage risk
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent removes internal disconnects from the computing device housing and relocates them to external positions. The liquid cooling system now uses external disconnects that are accessible from outside the housing, eliminating the need to open or access internal components for maintenance. This extraction of disconnects from the internal environment resolves the contradiction by providing serviceability (external access) while eliminating fluid leakage risk inside the housing.

Inventive Principle:
Principle #2Taking out (Extraction)

2Temperature

If multiple internal disconnects are provided for liquid cooling, then heat capture rate is improved, but device complexity and leak points increase

Engineering Contradiction:
Improveheat capture rateVSAvoidnumber of disconnects
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent combines multiple liquid cooling disconnect functions into external disconnect assemblies that are accessible from outside the housing. Instead of having multiple separate internal disconnects for different cooling zones, the system uses external disconnects that can service multiple internal cooling manifolds and heat capture points. This merging reduces the total number of disconnect points while maintaining the ability to capture heat from multiple locations.

Inventive Principle:
Principle #5Merging (Combining)

3Ease of operation

If internal disconnects are used, then serviceability is improved, but maintenance complexity and time increase

Engineering Contradiction:
ImproveserviceabilityVSAvoidmaintenance time
Core Design Contradiction:
Ease of operationVSLoss of time

Solution Approach 1:

The patent extracts all disconnect functionality from the internal housing environment and places it externally. This allows maintenance personnel to service the liquid cooling system by accessing external disconnects without needing to remove device components, open the housing, or navigate complex internal pathways. The extraction principle directly reduces maintenance time while maintaining full serviceability.

Inventive Principle:
Principle #2Taking out (Extraction)

4Object-affected harmful factors

If external disconnects are used, then fluid leakage risk is reduced, but connection accessibility may be compromised

Engineering Contradiction:
Improvefluid leakage riskVSAvoidconnection accessibility
Core Design Contradiction:
Object-affected harmful factorsVSEase of operation

Solution Approach 1:

The patent positions external disconnects on the housing exterior in locations that are accessible from the outside environment, effectively moving the connection interface to a different spatial dimension (from internal to external). This dimensional change allows maintenance personnel to access disconnects from any direction outside the housing, improving accessibility while simultaneously eliminating the risk of internal fluid leakage. The external positioning creates a safer operational environment without compromising serviceability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design achieves high heat capture rates (>90%) with reduced risk of fluid leakage and improved serviceability, allowing easy maintenance without turning the device around or removing it from the rack.

Implementation Method 1

liquid cooling is becoming a main strain on the hyperscale server industry. For example, liquid heat capture rate of greater than 90% is a goal

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

liquid cooling system that includes external disconnects

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS20250275100A1Computing system with external disconnects
Publication Date: 2025.08.28 AMD DESIGN LLC
  • US20250275100A1 patent drawing
  • US20250275100A1 patent drawing
  • US20250275100A1 patent drawing

AI summary

A computing device includes a plurality of rear inlet disconnects extend from the rear side of the housing. The rear inlet disconnects are operable to be fluidly coupled with a rack manifold and receive fluid from the rack manifold. The rear inlet disconnects include a rear-to-front disconnect and a rear-to-cooling disconnect. A front inlet manifold is coupled with the housing and includes at least one front inlet disconnect operable to be fluidly coupled with one or more inlet cooling disconnects extending from the front side of the housing. The inlet cooling disconnects are operable to be fluidly connected with the liquid cooling system. An inlet transmission tube is coupled with an outside surface of the housing. The inlet transmission tube in fluid communication with the rear-to-front disconnect and operable to direct the fluid from the rear-to-front disconnect to the front inlet manifold.