External RF Amplifier Layout for Compact Radio Signal Processing
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Solution Overview
Problem
The increasing complexity of radio frequency (RF) signal processing circuits in electronic devices leads to larger physical sizes and higher costs, as they require more space and resources, hindering the miniaturization and efficiency of wireless communication systems.
Innovation Solution
The proposed solution involves separating the amplification circuits of the amplification module, such as power amplifiers or low noise amplifiers, from the electronic device, allowing for a more compact design by distributing the RFIC and RFFE components across multiple substrates and using external chips to reduce the physical footprint and improve signal processing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the amplification circuits are integrated within the electronic device, then the signal processing capability is improved, but the physical size of the device increases
Solution Approach 1:
The patent extracts the amplification circuits from the main electronic device and places them in an external module. This separation allows the electronic device to maintain compact dimensions while still providing full signal processing capabilities through the externally located amplification circuits that can be connected via interface connectors.
Solution Approach 2:
The patent divides the complete signal processing system into separate functional modules: the main electronic device contains core processing components, while the amplification circuits are segmented into an external module. This modular segmentation enables independent optimization of each component's size and performance characteristics.
2Adaptability or versatility
If the RF signal processing circuit structure becomes complicated, then the processing functionality is improved, but the manufacturing cost increases
Solution Approach 1:
The patent segments the complex RF signal processing circuit into separate functional blocks distributed across different modules. This segmentation allows each module to be manufactured independently using optimized processes for its specific function, reducing overall manufacturing complexity and cost while maintaining complete processing functionality.
Solution Approach 2:
The external module containing amplification circuits can serve multiple communication functions and be used across different device types. This multi-functionality amortizes the manufacturing cost across larger production volumes and reduces the need for device-specific custom circuits.
Data Source
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AI summary
Various embodiments relate to an apparatus and a method for processing a radio signal in an electronic device. The electronic device may include: a communication processor; and a power amplifier electrically connected to the communication processor, the power amplifier including a first switch, an input port, a first output port, and a second output port, the power amplifier further including a first amplification circuit disposed on a first electrical path between the input port and the first switch, a second amplification circuit disposed on a second electrical path between the first switch and the first output port, and a third amplification circuit disposed on a third electrical path between the first switch and the second output port.