External Sensor Module Layout for Accurate Temperature Compensation
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Solution Overview
Problem
Conventional temperature control apparatuses face challenges in accurately compensating for temperature errors due to heat generated around the terminal bracket, as the compensation temperature sensor is often affected by internal case heat and cannot be easily positioned close to the terminal bracket.
Innovation Solution
The temperature control apparatus design includes a case with a rear end portion of the module board protruding outside through a slit, positioning the compensation temperature sensor outside the case to minimize heat influence, allowing for more accurate temperature measurement and facilitating maintenance by making the terminal bracket detachable.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the compensation temperature sensor is installed inside the case near the circuit board, then the device structure is compact and easy to manufacture, but the sensor is easily affected by heat inside the case, reducing measurement precision
Solution Approach 1:
The compensation temperature sensor is extracted from the internal case environment and positioned externally on the rear surface. The module board extends through a slit in the case to position the sensor outside the heat-generating interior, thereby eliminating thermal interference while maintaining manufacturing simplicity through the integrated module board design.
2Measurement precision
If the compensation temperature sensor is positioned close to the terminal bracket, then temperature compensation accuracy is improved, but the device structure becomes more complex and the sensor is harder to access for maintenance
Solution Approach 1:
The compensation temperature sensor is merged with the module board as an integrated unit. The sensor is mounted on the module board which is coupled to the base board, creating a unified structure that achieves close positioning to the terminal bracket for accurate measurement while maintaining overall structural simplicity through the integrated module board design.
Solution Approach 2:
The module board with the integrated sensor is extracted through a slit in the case rear surface, positioning the sensor externally near the terminal bracket. This extraction enables close proximity for accurate temperature compensation while the modular board structure maintains simplicity and facilitates maintenance access.
3Device complexity
If the module board is fixed inside the case, then the device structure is simple and robust, but maintenance and replacement of terminal brackets becomes difficult
Solution Approach 1:
The module board is extracted through a slit in the case rear surface and positioned externally. This extraction creates a removable configuration where the module board can be detached from the case, enabling easy maintenance and replacement of terminal brackets while maintaining a simple overall device structure through the modular design.
Solution Approach 2:
The module board transitions from a fixed internal position to a dynamic, removable external position. The board can be inserted through the slit and secured during operation, then removed when maintenance is needed, providing operational flexibility and ease of repair without complicating the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the accuracy of temperature sensing by reducing the impact of internal case heat on the compensation sensor and allows for easier maintenance and replacement of terminal brackets without altering the case, expanding the application range.
Implementation Method 1
A thermocouple is a temperature measuring sensor that measures a temperature value by using thermoelectromotive force generated in proportion to a temperature difference of a junction part by bonding two different metals.
Implementation Method 2
a separate compensation temperature sensor for measuring the temperature around the terminal bracket to which the wire is connected is disposed to sense the temperature around the terminal bracket
Data Source
AI summary
A temperature control apparatus includes; a case including an open front surface, a top surface extending from an upper end of the front surface toward a rear side, a bottom surface extending from a lower end of the front surface toward the rear side, left and right side surfaces extending from left and right side ends of the front surface, and a rear surface connecting rear ends of the top surface, the bottom surface, and the left and right side surfaces; a front cover shielding the front surface; a display panel disposed behind the front cover; a base board coupled to a rear surface of the front panel and having a front surface on which the display panel is mounted; a module board coupled to a rear surface of the base board in a direction perpendicular to the base board; and one or more terminal portions electrically connected to the module board. A circuit terminal coming into contact with a connection pin of the terminal portion is formed on one side surface of a rear end portion of the module board. The rear end portion of the module board on which the circuit terminal is formed passes through a slit formed in the rear surface and protrudes to an outside of the rear surface.