External Sensor Package Interface for Modular Device Miniaturization
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Solution Overview
Problem
The miniaturization of smart devices has led to limited space for mounting sensors, making it difficult to implement all desired functions and causing challenges in sensor replacement and error correction when failures occur, as built-in sensors are often irreplaceable and prone to errors.
Innovation Solution
An electronic device that can connect to an external sensor package, determining which group of sensors is connected and controlling functions based on pre-configured groups, allowing for the activation or deactivation of sensor functions based on device status, thereby providing additional functionalities and user convenience.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If sensors are mounted inside the electronic device to achieve miniaturization, then the device size is reduced, but the space for sensor mounting is limited and sensor replacement becomes difficult
Solution Approach 1:
The sensor system is divided into built-in sensors and external sensor packages. The external sensor packages can be detached and replaced independently, while the core device remains compact. This segmentation allows both miniaturization and easy sensor replacement to be achieved simultaneously.
Solution Approach 2:
External sensor packages contain multiple sensors nested within a single attachable unit. When attached to the electronic device, these nested sensors provide multiple functions without increasing the device's overall size significantly, while still allowing easy replacement of the entire package.
2Adaptability or versatility
If all desired sensors are mounted inside the electronic device, then all desired functions can be implemented, but the device size increases beyond miniaturization goals
Solution Approach 1:
External sensor packages serve as universal, attachable modules that can be added to the electronic device only when needed. Each package contains sensors that provide specific functions, allowing the device to achieve diverse functionality without permanently increasing its size or complexity.
Solution Approach 2:
The sensor configuration becomes dynamic rather than static. Users can attach or detach external sensor packages based on their current needs, allowing the device's functionality to adapt to different situations without requiring all sensors to be permanently built-in.
3Stability of the object's composition
If built-in sensors are used, then sensor functions are integrated, but error correction and failure handling become difficult
Solution Approach 1:
By separating sensors into built-in and external replaceable packages, the system enables easy error correction. When a sensor fails or produces errors, the entire external package can be replaced without disassembling the device or affecting other components, significantly improving ease of repair while maintaining integration for built-in sensors.
Data Source
AI summary
An electronic device and method utilizes an external sensor group to facilitate miniaturization the device and repair/replacement of external sensors. An interface connected to an external sensor package including at least one sensor. A processor that when the external sensor package is connected through the interface, determines from which group the external sensor package is included in among pre-configured groups and controls the performance of a function corresponding to the determined group.